Methods and apparatus for coupling semiconductor device manufacturing equipment to the facilities of a manufacturing location

Abstract

In a first aspect, an apparatus is provided for coupling a semiconductor device manufacturing tool to facilities. The apparatus includes (1) a docking station adapted to mount to a raised floor and having a thickness approximately equal to the raised floor; (2) a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station, each tool POC location being adapted to be connected to a POC of a semiconductor device manufacturing tool; and (3) a plurality of facilities POC locations disposed on a bottom surface of the docking station. Each facilities POC location is adapted to be connected to a POC of a facility. Numerous other aspects are provided.

1 . An apparatus for coupling a semiconductor device manufacturing tool to facilities, the apparatus comprising: 
 a docking station adapted to mount to a raised floor and having a thickness approximately equal to the raised floor;    a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station, wherein each tool POC location is adapted to be connected to a POC of a semiconductor device manufacturing tool; and    a plurality of facilities POC locations disposed on a bottom surface of the docking station, wherein each facilities POC location is adapted to be connected to a POC of a facility.    
   
   
       2 . The apparatus of  claim 1 , wherein the docking station is further adapted to mount to a raised floor in place of a standard raised floor tile.  
   
   
       3 . The apparatus of  claim 1 , wherein the thickness of the docking station is approximately equal to a standard raised floor tile.  
   
   
       4 . The apparatus of  claim 1 , wherein the bottom surface of the docking station is approximately co-planar with a bottom surface of the raised floor.  
   
   
       5 . The apparatus of  claim 1 , wherein a height of a space below the raised floor is approximately the same as a height of a space below the docking station.  
   
   
       6 . The apparatus of  claim 1 , wherein the facilities POC locations are disposed so that attaching the facility POCs does not interfere with support structures of the raised floor.  
   
   
       7 . The apparatus of  claim 1 , wherein the thickness of the docking station is such that attaching the facility POCs does not interfere with support structures of the raised floor.  
   
   
       8 . The apparatus of  claim 1 , wherein the top surface of the docking station is below a top surface of the raised floor.  
   
   
       9 . A method of pre-facilitating a semiconductor device manufacturing tool comprising: 
 providing a docking station having: 
 a thickness approximately equal to a raised floor,  
 a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station wherein each tool POC location is adapted to be connected to a POC of a semiconductor device manufacturing tool, and  
 a plurality of facilities POC locations disposed on a bottom surface of the docking station, wherein each facilities POC location is adapted to be connected to a POC of a facility;  
   mounting the docking station to the raised floor; and    connecting the facilities POC locations to POCs of a facility.    
   
   
       10 . The method of  claim 9 , wherein providing a docking station includes providing a docking station further adapted to mount to a raised floor in place of a standard raised floor tile.  
   
   
       11 . The method of  claim 9 , wherein providing a docking station includes providing a docking station wherein the thickness of the docking station is approximately equal to a standard raised floor tile.  
   
   
       12 . The method of  claim 9 , wherein providing a docking station includes providing a docking station wherein the bottom surface of the docking station is approximately co-planar with a bottom surface of the raised floor.  
   
   
       13 . The method of  claim 9 , wherein providing a docking station includes providing a docking station wherein a height of a space below the raised floor is approximately the same as a height of a space below the docking station.  
   
   
       14 . The method of  claim 9 , wherein providing a docking station includes providing a docking station wherein the facilities POC locations are disposed so that attaching the facility POCs does not interfere with support structures of the raised floor.  
   
   
       15 . The method of  claim 9 , wherein providing a docking station includes providing a docking station wherein the thickness of the docking station is such that attaching the facility POCs does not interfere with support structures of the raised floor.  
   
   
       16 . The method of  claim 9 , wherein providing a docking station includes providing a docking station wherein the top surface of the docking station is below a top surface of the raised floor.  
   
   
       17 . A method of manufacturing a docking station comprising: 
 constructing a frame having a thickness approximately equal to a raised floor;    installing a plurality of tool point of connection (POC) locations on a top surface of the frame wherein each tool POC location is adapted to be connected to a POC of a semiconductor device manufacturing tool; and    installing a plurality of facilities POC locations on a bottom surface of the frame, wherein each facilities POC location is adapted to be connected to a POC of a facility.    
   
   
       18 . The method of  claim 17 , wherein constructing a frame includes constructing a frame adapted to mount to a raised floor in place of a standard raised floor tile.  
   
   
       19 . The method of  claim 17 , wherein constructing a frame includes constructing a frame wherein the thickness of the frame is approximately equal to a standard raised floor tile.  
   
   
       20 . The method of  claim 17 , wherein constructing a frame includes constructing a frame wherein the bottom surface of the frame is approximately co-planar with a bottom surface of the raised floor.  
   
   
       21 . The method of  claim 17 , wherein constructing a frame includes constructing a frame wherein a height of a space below the raised floor is approximately the same as a height of a space below the frame.  
   
   
       22 . The method of  claim 17 , wherein constructing a frame includes constructing a frame wherein the facilities POC locations are disposed so that attaching the facility POCs does not interfere with support structures of the raised floor.  
   
   
       23 . The method of  claim 17 , wherein constructing a frame includes constructing a frame wherein the thickness of the frame is such that attaching the facility POCs does not interfere with support structures of the raised floor.  
   
   
       24 . The method of  claim 17 , wherein constructing a frame includes constructing a frame wherein the top surface of the frame is below a top surface of the raised floor.  
   
   
       25 . A raised floor system comprising: 
 a docking station having: 
 a thickness approximately equal to a raised floor,  
 a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station wherein each tool POC location is adapted to be connected to a POC of a semiconductor device manufacturing tool, and  
 a plurality of facilities POC locations disposed on a bottom surface of the docking station, wherein each facilities POC location is adapted to be connected to a POC of a facility; and  
   a raised floor adapted to support the docking station.    
   
   
       26 . The system of  claim 25 , wherein the docking station is further adapted to mount to the raised floor in place of a standard raised floor tile/panel.  
   
   
       27 . The system of  claim 25 , wherein the thickness of the docking station is approximately equal to a standard raised floor tile/panel.  
   
   
       28 . The system of  claim 25 , wherein the bottom surface of the docking station is approximately co-planar with a bottom surface of the raised floor.  
   
   
       29 . The system of  claim 25 , wherein a height of a space below the raised floor is approximately the same as a height of a space below the docking station.  
   
   
       30 . The system of  claim 25 , wherein the facilities POC locations are disposed so that attaching the facility POCs does not interfere with support structures of the raised floor.  
   
   
       31 . The system of  claim 25 , wherein the thickness of the docking station is such that attaching the facility POCs does not interfere with support structures of the raised floor.  
   
   
       32 . The system of  claim 25 , wherein the top surface of the docking station is below a top surface of the raised floor.  
   
   
       33 . A semiconductor device manufacturing system comprising: 
 a docking station having: 
 a thickness approximately equal to a raised floor,  
 a plurality of tool point of connection (POC) locations disposed on a top surface of the docking station wherein each tool POC location is adapted to be connected to a POC of a semiconductor device manufacturing tool, and  
 a plurality of facilities POC locations disposed on a bottom surface of the docking station, wherein each facilities POC location is adapted to be connected to a POC of a facility; and  
   a semiconductor device manufacturing tool including a plurality of tool POCs adapted to be coupled to the plurality of tool point of connection (POC) locations.    
   
   
       34 . The system of  claim 33 , wherein the docking station is further adapted to mount to the raised floor in place of a standard raised floor tile/panel.  
   
   
       35 . The system of  claim 33 , wherein the thickness of the docking station is approximately equal to a standard raised floor tile/panel.  
   
   
       36 . The system of  claim 33 , wherein the bottom surface of the docking station is approximately co-planar with a bottom surface of the raised floor.  
   
   
       37 . The system of  claim 33 , wherein a height of a space below the raised floor is approximately the same as a height of a space below the docking station.  
   
   
       38 . The system of  claim 33 , wherein the facilities POC locations are disposed so that attaching the facility POCs does not interfere with support structures of the raised floor.  
   
   
       39 . The system of  claim 33 , wherein the thickness of the docking station is such that attaching the facility POCs does not interfere with support structures of the raised floor.  
   
   
       40 . The system of  claim 33 , wherein the top surface of the docking station is below a top surface of the raised floor.