Optically Coupled Sealed-Cavity Resonator and Process

Abstract

A process to form a laterally offset photodiode for an optically coupled resonator includes implanting a semiconductor substrate to form the laterally offset photodiode adjacent to the resonator. The resonator masks the implanting underneath the resonator when the semiconductor substrate is implanted. Also disclosed is an optically coupled resonator, a process for fabricating an optically coupled resonator, and a device including an optically coupled resonator having a laterally offset photodiode.

1 . An optically coupled resonator, comprising: 
 a laterally offset photodiode adjacent to the resonator.    
   
   
       2 . The optically coupled resonator of  claim 1 , wherein the resonator is driven by an electric field generated between the laterally offset photodiode and the resonator when incident light strikes the photodiode.  
   
   
       3 . The optically coupled resonator of  claim 1 , wherein a vibration of the resonator is sensed with a reflected light, the reflected light reflected from at least one surface of the resonator.  
   
   
       4 . A device including an optically coupled resonator, comprising: 
 a laterally offset photodiode adjacent to the resonator, wherein the resonator is driven by an electric field generated between the laterally offset photodiode and the resonator when incident light strikes the photodiode.    
   
   
       5 . The device of  claim 4  selected from the group consisting of a strain sensor, a pressure sensor, an accelerometer, an angular rate sensor, a temperature sensor, a chemical sensor, a biological sensor, an explosives detector, a radiation detector, a radio-frequency filter, a voltage-controlled oscillator, a mechanical oscillator, and a resonant device.