Apparatus and Method for Terminating Probe Apparatus of Semiconductor Wafer

Abstract

A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side.

1 - 7 . (canceled)  
   
   
       8 . A probe apparatus for probing a semiconductor device by a tester, comprising: 
 a probe that probes the semiconductor device mounted on a probe station;    a signal cable that carries a signal from the probe to the tester;    a terminating device that terminates a proximal end of the probe with a distal end of the signal cable side by side.    
   
   
       9 . The probe apparatus of  claim 8 , wherein the probe comprises: 
 a probe conductor;    a dielectric layer, the dielectric layer being disposed around the probe conductor;    a conductive coating layer, the conductive coating layer covering and being disposed around the probe dielectric layer;    a conductive high temperature foam layer, the foam layer being disposed around the conductive coating layer; and    a strain relief clamping device mounting the probe onto the probe station.    
   
   
       10 . The probe apparatus of  claim 9 , wherein the signal cable comprises: 
 a center conductor;    a dielectric layer, the dielectric layer being disposed around the center conductor;    a conductive coating, the conductive coating covering and being disposed around the dielectric layer;    a conductive guard, the conductive guard being disposed around the conductive coating;    an insulator jacket, the insulator jacket covering the conductive guard; and    a second strain relief clamping device mounting the signal cable onto the probe station.    
   
   
       11 . The probe apparatus of  claim 10 , wherein the center conductor is a coaxial signal wire.  
   
   
       12 . The probe apparatus of  claim 10 , wherein the center conductor is a tri-axial signal wire.  
   
   
       13 . The probe apparatus of  claim 10 , wherein the terminating device further comprises a crimp which terminates the proximal end of the probe with the distal end of the signal cable side by side.  
   
   
       14 . The probe apparatus of  claim 13 , further comprising a second conductive high temperature foam layer which is disposed between the probe and the probe station on a first side, disposed between the signal cable and the probe station on a second side, and disposed within an opening area of the probe station therebetween.  
   
   
       15 . A method of terminating a probe that probes a semiconductor device with a signal cable from a tester, comprising the steps of: 
 stripping back at least one layer of the signal cable and at least one layer of the probe;    crimping a proximal end of the probe with a distal end of the signal cable side by side; and    mounting the probe and the signal cable in a chassis, wherein a distal end of the probe is extended towards the semiconductor device, and a proximal end of the signal cable is extended towards the tester.