Jewelry setting
Abstract
A jewelry setting and method for manufacturing same are provided. The jewelry setting includes a frame configured to receive a gemstone, the frame including a base and at least one sidewall defining a cavity for receiving the gemstone; and at least two prongs soldered to the at least one sidewall, wherein the at least two prongs extend above an upper peripheral edge of the sidewall for securing the gemstone in the frame. The method includes the steps providing the frame configured to receive the gemstone; providing at least two prongs, each of the at least two prongs includes a layer of solder disposed thereon; placing the at least two prongs in contact with the at least one sidewall of the frame; and heating the frame and the prongs to a predetermined temperature, wherein the solder will reflow and form a joint between the prongs and the sidewall.
Claims
exact text as granted — not AI-modified1 . A jewelry setting comprising:
a frame configured to receive a gemstone, the frame including a base and at least one sidewall defining a cavity for receiving the gemstone; and at least two prongs soldered to the at least one sidewall, wherein the at least two prongs extend above an upper peripheral edge of the at least one sidewall for securing the gemstone in the frame.
2 . The jewelry setting as in claim 1 , wherein the base of the frame includes at least one aperture.
3 . The jewelry setting as in claim 1 , wherein the at least two prongs are bent inwardly toward a center of the frame at a predetermined distance above the upper peripheral edge of the at least one sidewall.
4 . The jewelry setting as in claim 1 , further comprising a retainer member configured to center the received gemstone in the frame, the retainer member being disposed on the upper peripheral edge of the at least one sidewall.
5 . The jewelry setting as in claim 4 , wherein the retainer member is flat.
6 . The jewelry setting as in claim 4 , wherein the retainer member is configured with an inwardly down-sloping angle.
7 . The jewelry setting as in claim 1 , wherein each of the at least two prongs has a generally square cross-section.
8 . The jewelry setting as in claim 1 , wherein each of the at least two prongs includes a generally rectangular portion for mating with the at least one sidewall and two prong members extending from the rectangular portion for gripping the received gemstone.
9 . The jewelry setting as in claim 1 , wherein the shape of the frame generally corresponds to a shape of the gemstone.
10 . The jewelry setting as in claim 4 , wherein the shape of the retainer member generally corresponds to a shape of the gemstone.
11 . The jewelry setting as in claim 1 , further comprising a post soldered to an underside of the base of the frame.
12 . The jewelry setting as in claim 1 , wherein the at least one sidewall includes at least one cutout for exposing a lower portion of the gemstone received by the frame.
13 . The jewelry setting as in claim 12 , further comprising a retainer member configured to center the received gemstone, the retainer member being disposed on the upper peripheral edge of the at least one sidewall.
14 . A method for manufacturing a jewelry setting, the method comprising the steps:
providing a frame configured to receive a gemstone, the frame including a base and at least one sidewall defining a cavity for receiving the gemstone; providing at least two prongs, each of the at least two prongs includes a layer of solder disposed thereon; placing the at least two prongs in contact with the at least one sidewall of the frame; and heating the frame and the at least two prongs to a predetermined temperature, wherein the solder will reflow and form a joint between each of the at least two prongs and the at least one sidewall.
15 . The method as in claim 14 , further comprising the steps:
disposing a gemstone in the frame; and bending an upper portion of each of the at least two prongs inwardly relative to the frame to secure the gemstone in the frame.
16 . The method as in claim 14 , further comprising the steps:
before the heating step, providing a retainer member for centering the received gemstone, the retainer member including a layer of solder disposed thereon and disposing the retainer member on an upper peripheral edge of the at least one sidewall.
17 . The method as in claim 16 , further comprising the steps:
after the heating step, disposing a gemstone on the retainer member; and bending an upper portion of each of the at least two prongs inwardly relative to the frame to secure the gemstone in the frame.
18 . The method as in claim 14 , wherein the at least two prongs include an upper bent portion, the placing step further comprising the step disposing a gemstone in the frame, the upper bent portions contacting an upper portion of the gemstone and a lower portion of the at least two prongs contacting the at least one sidewall of the frame.
19 . The method as in claim 14 , wherein the at least two prongs include an upper bent portion, further comprising the steps:
providing a retainer member including a layer of solder; disposing the retainer member on an upper peripheral edge of the at least one sidewall of the frame; disposing a gemstone on the retainer member; and placing the upper bent portions in contact with an upper portion of the gemstone and a lower portion of the at least two prongs in contact with the at least one sidewall of the frame.
20 . The method as in claim 16 , further comprising the step providing a post including a solder disposed on at least one end and placing the at least one end of the post in contact with an underside of the base of the frame before the heating step.Join the waitlist — get patent alerts
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