Waterblock for cooling electrical and electronic circuitry

Abstract

A waterblock and accompanying cooling tube for carrying away heat generated by electrical or electronic components mounted on a circuit board or other substrate are disclosed. The cooling tube is attached to the waterblock by means of an adhesive or other suitable material, and is not positioned in a groove machined into the surface of the waterblock as has been done in past. The unique design of the waterblock and cooling tube eliminates the need to machine expensive grooves in the waterblock, thereby reducing manufacturing costs.

1 . A device for cooling at least one heat-generating electrical or electronic circuit in a circuit board, comprising: 
 (a) at least a first waterblock comprising a first surface configured for engagement with or positioning adjacent the circuit board, the waterblock further comprising at least a second surface;    (b) at least a first cooling tube comprising at least a first lumen and an outer surface, the at least first lumen being configured to carry a liquid therethrough such that the liquid does not leak from or through the tube to the outer surface thereof;    wherein the at least first cooling tube operably engages and is attached to the second surface of the waterblock, the second surface of the waterblock containing no voids, recesses or grooves for accepting the at least first cooling tube therein, the first cooling tube being configured to carry away at least a portion of the heat generated by the electrical or electronic circuit when the liquid flows therethrough.    
     
     
         2 . The device of  claim 1 , wherein the second surface is substantially flat.  
     
     
         3 . The device of  claim 1 , wherein the first surface is configured for attachment to at least a portion of the circuit board.  
     
     
         4 . The device of  claim 1 , wherein a portion of the outer surface of the cooling tube is configured for attachment to the second surface of the waterblock.  
     
     
         5 . The device of  claim 4 , wherein the portion of the outer surface of the cooling tube is substantially flat and configured for engagement or positioning on the second surface of the waterblock.  
     
     
         6 . The device of  claim 1 , wherein the at least first tube is one of circular, elliptical, rectangular, square, D-shaped and flattened in cross-section.  
     
     
         7 . The device of  claim 1 , wherein at least a portion of the cooling tube is serpentine in shape.  
     
     
         8 . The device of  claim 1 , wherein an adhesive-containing material is disposed between the second surface and the cooling tube.  
     
     
         9 . The device of  claim 8 , wherein the adhesive-containing material is at least one of a thermally conductive material, foam, tape, glue, epoxy and thermally conductive epoxy.  
     
     
         10 . The device of  claim 1 , wherein a solder or brazing material is disposed between the second surface and the cooling tube.  
     
     
         11 . The device of  claim 1 , wherein a thermally conductive material is disposed between the second surface and the cooling tube.  
     
     
         12 . The device of  claim 1 , wherein the waterblock is grooveless.  
     
     
         13 . The device of  claim 1 , wherein the waterblock has no groove for accepting the cooling tube therein.  
     
     
         14 . The device of  claim 1 , wherein the first surface is substantially planar.  
     
     
         15 . The device of  claim 1 , wherein the waterblock comprises cooling fins or cooling grooves.  
     
     
         16 . The device of  claim 1 , wherein the waterblock comprises a material selected from the group consisting of aluminum, a ceramic-containing material, stainless steel, copper, zinc, aluminum-silicon carbide, and alloys, combinations or mixtures of all the foregoing.  
     
     
         17 . The device of  claim 1 , wherein the waterblock comprises a material selected from the group consisting of aluminum, stainless steel, copper, zinc, aluminum-silicon carbide and alloys, combinations or mixtures of all the foregoing.  
     
     
         18 . The device of  claim 1 , wherein the first cooling tube comprises a material selected from the group consisting of aluminum, stainless steel, copper, zinc and alloys, combinations or mixtures of all the foregoing.  
     
     
         19 . The device of  claim 1 , wherein the first cooling tube is attached to the waterblock by at least one of glue, epoxy, a thermally conductive adhesive, a fixture for attachment of the tube to the waterblock, at least one bolt, at least one screw, brazing, soldering, welding, crimping and combinations or mixtures of any of the foregoing.  
     
     
         20 . The device of  claim 9 , further comprising a plurality of waterblocks.  
     
     
         21 . The device of  claim 9 , further comprising a plurality of cooling tubes.  
     
     
         22 . The device of  claim 1 , wherein the liquid is selected from the group consisting of water, COOLANOL, Polyalpha Olefin (PAO) dielectric coolant fluid, synthetic hydrocarbon oils ethylene glycol and ethylene glycol/water mixture.  
     
     
         23 . A means for cooling at least one heat-generating electrical or electronic circuit in a circuit board, comprising: 
 (a) at least a first means for conducting thermal energy comprising a first surface configured for engagement with or positioning adjacent the circuit board, the thermal energy conducting means further comprising at least a second surface;    (b) at least a first means for carrying a fluid within a lumen comprising an outer surface, the lumen being configured to carry the fluid therethrough such that the fluid does not leak from or through the fluid carrying means to the outer surface thereof;    wherein the fluid carrying means operably engages and is attached to the second surface of the thermal energy conducting means, the second surface of the thermal energy conducting means containing no voids, recesses or grooves for accepting the fluid carrying means therein, the fluid carrying means being configured to carry away at least a portion of the heat generated by the electrical or electronic circuit when the fluid flows therethrough.    
     
     
         24 . The device of  claim 22 , wherein the second surface is substantially flat.  
     
     
         25 . The device of  claim 22 , wherein the first surface is configured for attachment to at least a portion of the circuit board.  
     
     
         26 . The device of  claim 1 , wherein a portion of the outer surface of the fluid carrying means is configured for attachment to the second surface of the thermal energy conducting means.  
     
     
         27 . A method of making a device for cooling at least one heat-generating electrical or electronic circuit in a circuit board, the device comprising at least a first waterblock comprising a first surface configured for engagement with or positioning adjacent the circuit board, the waterblock further comprising at least a second surface, at least a first cooling tube comprising at least a first lumen and an outer surface, the at least first lumen being configured to carry a liquid therethrough such that the liquid does not leak from or through the tube to the outer surface thereof, the at least first cooling tube operably engaging and being attached to the second surface of the waterblock, the second surface of the waterblock containing no voids, recesses or grooves for accepting the at least first cooling tube therein, the first cooling tube being configured to carry away at least a portion of the heat generated by the electrical or electronic circuit when the liquid flows therethrough, the method comprising: 
 (a) providing the waterblock;    (b) providing the cooling tube; and    (c) attaching the cooling tube to the waterblock.