Cooling device having a slanted heat pipe

Abstract

A cooling device having a slanted heat pipe. The cooling device includes a cooling fin set, a cooling substrate and at least a heat pipe. The cooling substrate is disposed at one side of the cooling fin set. The heat pipe includes an absorption region and a dissipation region. The dissipation region is disposed on the cooling fin set, while the absorption region is affixed to the cooling substrate. The heat pipe is slanted between the cooling substrate and the cooling fin set with an altitude difference. Consequently, the dissipation region of the heat pipe is located higher than the absorption region. In this manner, both the vaporized working fluid and the condensed working fluid can transfer rapidly between one end of the heat pipe to the other end. Thus, an enhanced cooling rate is obtained.

1 . A cooling device having a slanted heat pipe, comprising: 
 a cooling fin set;    a cooling substrate disposed at one side of the cooling fin set;    at least a heat pipe comprising an absorption region and a dissipation region, the dissipation region being disposed on the cooling fin set, the absorption region being affixed to the cooling substrate, which is characterized in that:    the heat pipe is slanted between the cooling substrate and the cooling fin set with an altitude difference, thereby making the dissipation region of the heat pipe higher than the absorption region.    
   
   
       2 . The cooling device as recited in  claim 1 , wherein a heat conducting piece is securely fastened on the heat pipe corresponding the location of the cooling substrate, thereby sandwiching one end of the heat pipe between the cooling substrate and the heat conducting piece.