Damascene copper plating for coils in thin film heads

Abstract

An optimized plating bath composition suitable for plating coil structures in thin film magnetic heads is disclosed. The disclosed bath composition is based on Shipley High Acid Damascene copper electroplating baths containing A-2001 accelerator and S-2001 suppressor components.

1 . A copper plating bath for depositing coil structures in thin film magnetic heads comprising: 
 a Shipley Ultrafill ST2001 High Acid Bath; and,    an additive package containing Ultrafill A-2001 accelerator having a concentration less than 1.0 ml/liter and greater than or equal to 0.1 ml/liter.    
   
   
       2 . The copper plating bath as recited in  claim 1  wherein said Ultrafill A-2001 accelerator concentration is between 0.1 mL/liter and 0.5 mL/liter.  
   
   
       3 . The copper plating bath as recited in  claim 1  wherein said additive package further contains Ultrafill S-2001 suppressor having a concentration less than 25 mL/liter and greater than or equal to 5 mL/liter.  
   
   
       4 . The copper plating bath as recited in  claim 1  wherein said Shipley Ultrafill ST2001 High Acid Bath has a copper concentration between 17.5 and 21 grams/liter and a sulfuric acid concentration between 175 and 210 grams/liter.  
   
   
       5 . A copper plating bath for depositing coil structures in thin film magnetic heads comprising: 
 a Shipley Ultrafill ST2001 High Acid Bath having a copper concentration between 17.5 and 21 grams/liter and a sulfuric acid concentration between 175 and 210 grams/liter;    Ultrafill A-2001 accelerator having a concentration less than 1.0 ml/liter and greater than or equal to 0.1 ml/liter; and,    Ultrafill S-2001 suppressor having a concentration less than 25 mL/liter and greater than or equal to 5 mL/liter.    
   
   
       6 . The copper plating bath as recited in  claim 5  wherein said Ultrafill A-2001 accelerator concentration is between 0.5 ml/liter and 0.1 ml/liter.