Method of selective post-growth tuning of an optical bandgap of a semi-conductor heterostructure and products produced thereof
Abstract
A method of controlling the degree of IFVEI for post-growth tuning of an optical bandgap of a semiconductor heterostructure. The resultant layer structure may contain a semi-conductor heterostructure with one or more regions with selectively modified bandgap. According to one aspect of the invention, a metal interlayer is deposited between the heterostructure and a dielectric layer such as silica. According to another aspect of the invention, an oxidized surface is provided between a dielectric layer and the heterostructure. The presence of the oxide layer improves stability and reproducibility in the post-annealing process. In a further aspect, the oxide layer may be provided between the interlayer and the heterostructure. In one embodiment of the invention, a photoresist mask with a specific pattern is deposited on the surface of the heterostructure so that the interlayer is deposited in an unmasked region whereon post-growth tuning results. In another embodiment, multiple photolithography is performed to deposit interlayers of varying thickness and/or regions on the heterostructure, followed by thermal post-annealing of the dielectric layer. This method produces heterostructures with optical bandgaps having selectively tuned regions.
Claims
exact text as granted — not AI-modified1 . A layer structure comprising:
a semi-conductor heterostructure; at least one metallic interlayer deposited next to at least one surface and in at least one region of said semiconductor heterostructure; and a dielectric layer coated next to said at least one metallic interlayer.
2 . A layer structure according to claim 1 , wherein only one surface is deposited with said at least one metallic interlayer.
3 . A layer structure according to claim 1 , wherein only the top surface is deposited with said at least one metallic interlayer.
4 . A layer structure according to claim 1 , further comprising an oxide layer between said semiconductor heterostructure and said at least one metallic interlayer.
5 . A layer structure according to claim 2 further comprising an oxide layer between said semiconductor heterostructure and said at least one metallic interlayer.
6 . A layer structure according to claim 2 , wherein said semiconductor heterostructure is a single quantum well structure, a multiple quantum well structure, a superlattice structure or a quantum dot structure.
7 . A layer structure according to claim 2 , wherein said semiconductor heterostructure comprises:
a As/GaAs quantum well structure having a plurality of alternating AlGaAs and GaAs layers; or an InGaAs/GaAs quantum well structure having a plurality of alternating InGaAs and GaAs layers.
8 . A layer structure according to claim 2 , wherein said at least one metallic interlayer comprises a single layer of metal, a single layer of alloyed metal, multiple layers of metal, multiple layers of alloyed metal, or multiple layers of metal and alloyed metal.
9 . A layer structure according to claim 2 , wherein said at least one metallic interlayer is 1 to 10,000 angstrom thick.
10 . A layer structure according to claim 2 , wherein said at least one metallic interlayer is 10 to 500 angstrom thick.
11 . A layer structure according to claim 2 , wherein a plurality of metallic interlayers are deposited in different regions of said semiconductor heterostructure.
12 . A layer structure according to claim 2 , wherein a plurality of metallic interlayers are deposited in different regions of said semiconductor heterostructure, and at least two of said metallic interlayers have different thicknesses.
13 . A layer structure according to claim 2 , wherein said dielectric layer is made from silica oxide or silica.
14 . A layer structure according to claim 5 , wherein said semiconductor heterostructure is a single quantum well structure, a multiple quantum well structure, a superlattice structure or a quantum dot structure.
15 . A layer structure according to claim 5 , wherein said semiconductor heterostructure comprises:
a AlGaAs/GaAs quantum well structure having a plurality of alternating AlGaAs and GaAs layers; or an InGaAs/GaAs quantum well structure having a plurality of alternating InGaAs and GaAs layers.
16 . A layer structure according to claim 5 , wherein said at least one metallic interlayer comprises a single layer of metal, a single layer of alloyed metal, multiple layers of metal, multiple layers of alloyed metal, or multiple layers of metal and alloyed metal.
17 . A layer structure according to claim 5 , wherein said at least one metallic interlayer is 1 to 10,000 angstrom thick.
18 . A layer structure according to claim 5 , wherein said at least one metallic interlayer is 10 to 500 angstrom thick.
19 . A layer structure according to claim 5 , wherein a plurality of metallic interlayers are deposited in different regions of said semiconductor heterostructure.
20 . A layer structure according to claim 5 , wherein a plurality of metallic interlayers are deposited in different regions of said semiconductor heterostructure, and at least two of said metallic interlayers have different thicknesses.
21 . A layer structure according to claim 5 , wherein said semiconductor heterostructure is made from elements from column III to V of the periodic table of elements.
22 . A layer structure according to claim 5 , wherein said dielectric layer is made from silica oxide or silica.
23 . A layer structure comprising:
a semi-conductor heterostructure; at least one oxide layer formed on at least one surface of said semiconductor heterostructure; and a dielectric layer coated next to said oxide layer.
24 . A layer structure according to claim 23 , wherein said at least one oxide layer is formed by the oxidation of said surface of said semiconductor heterostructure.Join the waitlist — get patent alerts
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