US2007095661A1PendingUtilityA1
Method of making, and, analyte sensor
Est. expiryOct 31, 2025(expired)· nominal 20-yr term from priority
H01M 4/8885C23C 14/3464C23C 14/205C23C 14/0694Y02E60/50
55
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Claims
Abstract
The subject invention provides conductive stripes, suitable for use as electrodes, and methods of making conductive stripes.
Claims
exact text as granted — not AI-modified1 . A method of making an electrode comprising:
sputtering a conductive layer on an inert substrate; and applying an insoluble reactive layer over the conductive layer.
2 . The method of claim 1 , wherein applying an insoluble reactive layer comprises:
sputtering the insoluble reactive layer over the conductive layer.
3 . The method of claim 2 , wherein sputtering the insoluble reactive layer comprises:
sputtering at least two materials concurrently to form the reactive layer.
4 . The method of claim 3 , wherein sputtering at least two materials concurrently comprises:
using a first target of a first material and a second target of a second material.
5 . The method of claim 3 , wherein sputtering at least two materials concurrently comprises:
using a first target comprising a first material and a second material.
6 . The method of claim 1 , wherein applying an insoluble reactive layer comprises:
applying a colloid over the conductive layer.
7 . The method of claim 1 , wherein:
sputtering a conductive layer comprises sputtering silver; and applying an insoluble reactive layer over the conductive layer comprises applying AgCl.
8 . The method of claim 7 , wherein applying an insoluble reactive layer over the conductive layer comprises applying Ag and AgCl.
9 . The method of claim 7 , wherein applying an insoluble reactive layer over the conductive layer comprises applying colloidal AgCl.
10 . A method of making an electrode comprising:
sputtering a conductive layer on an inert substrate; and sputtering a reactive layer over the conductive layer.
11 . The method of claim 10 , wherein sputtering a reactive layer comprises:
concurrently sputtering a first material and a second material.
12 . The method of claim 11 , wherein concurrently sputtering a first material and a second material comprises:
using a first target of a first material and a second target of a second material.
13 . The method of claim 11 , wherein concurrently sputtering a first material and a second material comprises:
using a first target comprising a first material and a second material.
14 . A sensor comprising an electrode, the electrode comprising a conductive layer and an insoluble reactive layer over the conductive layer.
15 . The sensor of claim 14 further comprising an inert substrate, the conductive layer on the insert substrate.
16 . The sensor of claim 15 , further comprising a working electrode and a counter electrode, and wherein the electrode is the counter electrode.
17 . The sensor of claim 14 , wherein the reactive layer comprises AgCl.
18 . The sensor of claim 17 , wherein the reactive layer comprises colloidal AgCl.
19 . The sensor of claim 17 , wherein the reactive layer comprises sputtered AgCl.
20 . The sensor of claim 17 , wherein the reactive layer comprises Ag and AgCl.Join the waitlist — get patent alerts
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