US2007096271A1PendingUtilityA1

Substrate frame

48
Assignee: TAKAHASHI NORIOPriority: Sep 1, 2003Filed: Dec 21, 2006Published: May 3, 2007
Est. expirySep 1, 2023(expired)· nominal 20-yr term from priority
Inventors:Norio Takahashi
H10W 90/754H10W 90/734H10W 74/00H10W 72/932H10W 72/884H10W 70/688H05K 3/0052H05K 3/0097H05K 2201/09063H05K 2201/09781H05K 2201/2009H05K 2203/1545Y10T29/4913Y10T29/49146Y10T29/49121Y10T428/24314
48
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Claims

Abstract

A substrate frame includes an insulative board ( 10 a ) having a pair of ear portions ( 13 ) extending along its longitudinal edges; a plurality of wiring substrate regions ( 11 ) arranged on the insulative board ( 10 a ) between the ear portions ( 13 ) at predetermined intervals; and a plurality of grooves ( 18 ) provided around said wiring substrate regions ( 11 ) from which wiring patterns are removed.

Claims

exact text as granted — not AI-modified
1 . A substrate frame comprising: 
 an insulative board having a pair of ear portions extending along its longitudinal edges;    a plurality of wiring substrate regions arranged on said insulative board between said ear portions at predetermined intervals; and    a plurality of grooves provided around said wiring substrate regions from which wiring patterns are removed.    
   
   
       2 . The substrate frame according to  claim 1 , wherein said grooves are made by boundries of said wiring substrate regions.  
   
   
       3 . The substrate frame according to  claim 1 , wherein said grooves are made suitable for punching to provide individual semiconductor devices.

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