Structure for heat dissipation in a portable computer

Abstract

The structure for heat dissipation in a portable computer according the present invention is a structural design that provides an additional heat dissipation room in the main containing space inside the notebook computer, and provides heat dissipation module in the heat dissipation room, such that the efficiency of heat dissipation is raised. The heat dissipation module includes a heat conductor, a fan, and a heat dissipation plate. Besides, air inlet and air outlet are provided in the heat dissipation room to enable air convection during heat exchange, and accordingly ameliorate the drawback of insufficient heat dissipation in a conventional structure.

1 . A structure for heat dissipation in a portable computer, more specifically, an additional heat dissipation room is installed in a notebook computer, the said heat dissipation room is separated from the containing space in the computer by a separator, such that a heat dissipation module is installed inside the heat dissipation room, and air inlets and air outlets are provided at both sides of the heat dissipation room; the said heat dissipation module is composed of a heat conductor, a fan, and a heat dissipation plate, wherein 
 one end of the heat conductor, which is provided for conducting heat, is attached on the chip of main board or heat sink of the chip, while the other end is attached on the heat dissipation plate in the dissipation room;    the fan, which is provided for forcing air convection and heat exchange, is installed in the heat dissipation room with locations of installation corresponding to the air inlets and air outlets;    The heat dissipation plate, which is made of metal material with good property of heat dissipation, is formed with multiple fins on the surface, and is connected by the heat conductor;    the said heat dissipation module is provided mainly for conducting heat generated by the chip in the containing space of computer through heat conductor to the heat dissipation plate in the heat dissipation room, and then accelerates the air convection by the fans through air inlets and air outlets.    
   
   
       2 . A structure for heat dissipation in a portable computer in accordance with  claim 1 , wherein the heat conductor may be embodied by a heat pipe.  
   
   
       3 . A structure for heat dissipation in a portable computer in accordance with  claim 1 , wherein the heat conductor may be embodied by a thermoelectric cooling kit.  
   
   
       4 . A structure for heat dissipation in a portable computer in accordance with  claim 1 , wherein an additional thermoelectric cooling kit may be put between the heat conductor and the heat dissipation plate.  
   
   
       5 . A structure for heat dissipation in a portable computer in accordance with  claim 1 , wherein an additional heat insulator may be installed under the bottom of heat dissipation room.  
   
   
       6 . A structure for heat dissipation in a portable computer, more specifically, an additional heat dissipation room is installed in notebook computer, the said heat dissipation room is separated from the containing space in the computer by a separator, such that heat dissipation module is installed inside the heat dissipation room, and air inlets and air outlets are provided at both sides of the heat dissipation room; the said heat dissipation module at least includes a heat conductor, a fan, and a heat dissipation plate, wherein 
 the chip on the main board of the containing space is reversely installed, such that the heat conductor of the heat dissipation module directly contacts the chip, and the other end of heat conductor contacts heat dissipation plate, the heat generated by chip is directly conducted to heat conductor and then conducted to the heat dissipation plate in the heat dissipation room, in order to increase area and effect for heat dissipation.