Assembly device for a sidelight light source module and liquid crystal panel

Abstract

An assembly device for a sidelight light source module and liquid crystal panel, comprising: a liquid crystal panel; a light guide panel; a light reflecting plate; a light source module installed at a side of the light guide panel; wherein the light source module comprises: a circuit board, on top of is soldered blue light chips and red light chips; a luminescence fluorescent layer positioned on top of the blue light chips and the red light chips. Mixed light consisting of the excited light, the blue light and the red light is transmitted out the fluorescent layer and forms a white light that passes through the light guide panel, the light reflecting plate, and is finally transmitted out the liquid crystal panel.

1 . An assembly device for a sidelight light source module and liquid crystal panel, comprising: 
 a liquid crystal panel;    a light guide panel positioned below the liquid crystal panel;    a light reflecting plate positioned below the light guide panel;    a light source module installed at a side of the light guide panel;    wherein the light source module comprises:    a circuit board, on top of which is soldered at least more than one blue light chip that serves as a blue light light-emitting source and at least more than one red light chip that serves as a red light light-emitting source, wherein the blue light chips and the red light chips are reciprocally adjacent;    a luminescence fluorescent layer positioned on top of the blue light chips and the red light chips, wherein blue light primarily excites the fluorescent layer and emits excited light having wavelength between 500 and 570 mm; mixed light consisting of the excited light, the blue light and the red light is transmitted out the fluorescent layer and forms a white light light source that is guided by the light guide panel into the light reflecting plate, where it undergoes refraction and then transmitted out the liquid crystal panel.    
   
   
       2 . The side light source type module and liquid crystal panel assembly device according to  claim 1 , wherein the fluorescent layer encapsulates the adjacent blue light chips and red light chips.  
   
   
       3 . The side light source type module and liquid crystal panel assembly device according to  claim 1 , wherein a light diffuser plate is disposed on top of the light guide panel, and the fluorescent layer is uniformly coated on a surface of the light diffuser plate; 
 the blue light chips and the red light chips soldered on the circuit board are covered with a transparent rubber layer.    
   
   
       4 . The side light source type module and liquid crystal panel assembly device according to  claim 1 , wherein the blue light chips and the red light chips are independently respectively disposed in grooves of light reflecting covers, and electrode leads of the two light reflecting covers are respectively soldered to a circuit board; a separation distance between the two reflecting covers is controlled to be within 1 mm; 
 the grooves of the two light reflecting covers are filled with the transparent rubber layer and a surface of the circuit board is coated with the transparent rubber layer.    
   
   
       5 . The side light source type module and liquid crystal panel assembly device according to  claim 1 , wherein fluorescent powder of the fluorescent layer is composed of substances including yttrium aluminum garnet or silicates (SmOn 4− ) or borates (BxOy 3− ).  
   
   
       6 . The side light source type module and liquid crystal panel assembly device according to  claim 1 , wherein the blue light chip and the red light chip are connected in the groove of the same light reflecting cover, the groove is filled with the fluorescent layer, and the two electrode leads are soldered to the circuit board.  
   
   
       7 . The side light source type module and liquid crystal panel assembly device according to  claim 1 , wherein the substances constituting the fluorescent powder is compounded from one or two or three of the following compounds: 
 cerium activator containing Y and Al yttrium aluminum garnet (YAG:Ce 3+ );    europium activated garnet (YAG:Eu 2+/3+ );    terbium activated garnet (YAG:Tb 3+ ).    
   
   
       8 . The side light source type module and liquid crystal panel assembly device according to  claim 1 , wherein a transparent light intensifying film or a light intensifying prism plate is additionally disposed between the liquid crystal panel and the light diffuser plate.  
   
   
       9 . The side light source type module and liquid crystal panel assembly device according to  claim 1 , wherein a plurality of the paired blue light chips and the red light chips are arranged to form at least one row on the circuit board, and are soldered on the circuit board using a one-dimensional straight line array arrangement.  
   
   
       10 . The side light source type module and liquid crystal panel assembly device according to  claim 1 , wherein a bottom surface of the light diffuser plate is formed with a prism surface consisting of adjoining ridges and valleys having included angle smaller than 90°.