High conductivity inks with low minimum curing temperatures

Abstract

Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.

1 - 34 . (canceled)  
   
   
       35 . A method for preparing a solid pure metal conductor on a substrate comprising the steps of 
 (a) mixing a reactive organic medium, a metal powder, and a cure temperature lowering agent;    (b) applying the mixture formed in step (a) onto the substrate; and    (c) heating the substrate at a critical temperature less than 200° C. for a time less than about 30 minutes;    wherein the applied mixture is converted into a well-consolidated pure metal conductor.    
   
   
       36 . The method of  claim 35 , further comprising roll milling the mixture to produce a homogeneous composition.  
   
   
       37 . The method of  claim 35 , wherein the metal powder has an average particle size of from about 0.05 to 15 μm.  
   
   
       38 . The method of  claim 35 , wherein the reactive organic medium is a metallo-organic decomposition compound, an organic reactive reagent which can form a metallo-organic decomposition compound upon reaction with the metal constituent or a mixture thereof.  
   
   
       39 . The method of  claim 35 , wherein the mixture is applied by printing.  
   
   
       40 . The method of  claim 39 , wherein the printing technique is selected from screen printing, rotary screen printing, gravure printing, intaglio printing, flexographic printing, letterpress printing, lithographic printing, ink jet printing or electrostatic printing.  
   
   
       41 . The method of  claim 35 , wherein the metal is silver.  
   
   
       42 . The method of  claim 41 , wherein the temperature is between 120° C. and 150° C.  
   
   
       43 . The method of  claim 38 , wherein the cure temperature lowering agent is a polymer selected from polyvinylidene chloride, polyvinyl chloride, polyethylene vinyl chloride, or copolymers thereof.  
   
   
       44 . The method of  claim 38 , wherein the cure temperature lowering agent is an organic glycol ether.  
   
   
       45 . The method of  claim 44 , wherein the cure temperature lowering agent is dipropylene glycol methyl ether.  
   
   
       46 . A method for preparing a solid pure metal conductor on a substrate comprising the steps of 
 (a) mixing (i) a metallo-organic decomposition compound; 
 (ii) a metal powder in an amount 1 to 20 times the amount of the metallo-organic decomposition compound by weight; and  
 (iii) a cure temperature lowering agent in the amount of 0.5 to 10% by weight;  
   (b) printing the mixture formed in step (a) onto the substrate; and    (c) heating the substrate at a critical temperature less than 200° C. for a time less than about 30 minutes;    wherein the printed mixture is converted into a well-consolidated pure metal conductor.    
   
   
       47 . The method of  claim 46 , further comprising roll milling the mixture to produce a homogeneous composition.  
   
   
       48 . The method of  claim 46 , wherein the metal powder has an average particle size of from about 0.05 to 15 μm.  
   
   
       49 . The method of  claim 46 , wherein the mixture is printed by a method selected from screen printing, rotary screen printing, gravure printing, intaglio printing, flexographic printing, letterpress printing, lithographic printing, ink jet printing or electrostatic printing.  
   
   
       50 . The method of  claim 46 , wherein the substrate is selected from polyester, polyimide, epoxy or paper.  
   
   
       51 . The method of  claim 46 , wherein the cure temperature lowering agent is a polymer selected from polyvinylidene chloride, polyvinyl chloride, polyethylene vinyl chloride, or copolymers thereof.  
   
   
       52 . The method of  claim 46 , wherein the cure temperature lowering agent is an organic glycol ether.  
   
   
       53 . The method of  claim 52 , wherein the cure temperature lowering agent is dipropylene glycol methyl ether.  
   
   
       54 . The method of  claim 46 , wherein the metal powder is silver.  
   
   
       55 . The method of  claim 54 , wherein the temperature is between 120° C. and 150° C.  
   
   
       56 . A method for preparing a solid metal conductor on a substrate comprising the steps of 
 (a) mixing a reactive organic medium and a metal powder;    (b) coating the substrate with a cure temperature lowering agent;    (c) applying the mixture formed in step (a) onto the coated substrate; and    (d) heating the substrate at a critical temperature less than 200° C. for a time less than about 30 minutes;    wherein the applied mixture is converted into a well-consolidated pure metal conductor.    
   
   
       57 . The method of  claim 56 , further comprising roll milling the mixture to produce a homogeneous composition.  
   
   
       58 . The method of  claim 56 , wherein the metal powder has an average particle size of from about 0.05 to 15 μm.  
   
   
       59 . The method of  claim 56 , wherein the reactive organic medium is a metallo-organic decomposition compound, an organic reactive reagent which can form a metallo-organic decomposition compound upon reaction with the metal constituent or a mixture thereof.  
   
   
       60 . The method of  claim 56 , wherein the mixture is applied by printing.  
   
   
       61 . The method of  claim 60 , wherein the printing technique is selected from screen printing, rotary screen printing, gravure printing, intaglio printing, flexographic printing, letterpress printing, lithographic printing, ink jet printing or electrostatic printing.  
   
   
       62 . The method of  claim 56 , wherein the metal powder is silver.  
   
   
       63 . The method of  claim 62 , wherein the temperature is between 120° C. and 150° C.  
   
   
       64 . The method of  claim 56 , wherein the cure temperature lowering agent is a polymer selected from polyvinylidene chloride, polyvinyl chloride, polyethylene vinyl chloride, or copolymers thereof.  
   
   
       65 . A method for preparing a solid pure metal conductor on a substrate comprising the steps of 
 (a) mixing (i) a metallo-organic decomposition compound; and 
 (ii) a metal powder in an amount 1 to 20 times the amount of the metallo-organic decomposition compound by weight;  
   (b) coating the substrate with a cure temperature lowering agent in the amount of 0.5 to 10% by weight;    (c) printing the mixture formed in step (a) onto the substrate; and    (d) heating the substrate at a critical temperature less than 200° C. for a time less than about 30 minutes;    wherein the printed mixture is converted into a well-consolidated pure metal conductor.    
   
   
       66 . The method of  claim 65 , further comprising roll milling the mixture to produce a homogeneous composition.  
   
   
       67 . The method of  claim 65 , wherein the metal powder has an average particle size of from about 0.1 to 15 μm.  
   
   
       68 . The method of  claim 65 , wherein the mixture is printed by a method selected from screen printing, rotary screen printing, gravure printing, intaglio printing, flexographic printing, letterpress printing, lithographic printing, ink jet printing or electrostatic printing.  
   
   
       69 . The method of  claim 65 , wherein the substrate is selected from polyester, polyimide, epoxy or paper.  
   
   
       70 . The method of  claim 65 , wherein the cure temperature lowering agent is a polymer selected from polyvinylidene chloride, polyvinyl chloride, polyethylene vinyl chloride, or copolymers thereof.  
   
   
       71 . The method of  claim 65 , wherein the metal powder is silver.  
   
   
       72 . The method of  claim 71 , wherein the temperature is between 120° C. and 150° C.