US2007107551A1PendingUtilityA1

Kish-derived graphitic heat spreaders and foils

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Assignee: KLETT JAMES WPriority: Nov 15, 2005Filed: Nov 15, 2005Published: May 17, 2007
Est. expiryNov 15, 2025(expired)· nominal 20-yr term from priority
C22B 3/10C22B 7/04C21C 1/08C22B 7/02Y02P10/20
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Claims

Abstract

A method of producing low cost high thermal conductivity graphitic foils includes the steps of providing a plurality of partially purified waste flakes formed during iron smelting, and compacting the plurality of waste flakes into a flexible foil material. A thermally conductive foil includes a plurality of partially purified pressed waste flakes derived from iron smelting, the foil having trace impurities characteristic of formation during iron smelting.

Claims

exact text as granted — not AI-modified
1 . A method of producing low cost high thermal conductivity graphitic foils, comprising the step of: 
 providing a plurality of partially purified waste flakes formed during iron smelting, and    compacting said plurality of waste flakes into a flexible foil material.    
   
   
       2 . The method of  claim 1 , wherein said compacting step comprises pressing said plurality of flakes into a foil, wherein no binder material is added before said pressing step.  
   
   
       3 . The method of  claim 2 , wherein said pressing step comprises pressing said plurality of flakes in a mold die coated with a mold release film.  
   
   
       4 . The method of  claim 3 , wherein said plurality of waste flakes are pressed without a prior exfoliation step.  
   
   
       5 . A thermally conductive foil, comprising: 
 a foil comprising a plurality of partially purified pressed waste flakes derived from iron smelting, said foil having trace impurities characteristic of formation during iron smelting.    
   
   
       6 . The foil of  claim 5 , wherein said foil is exclusive of any added binder material.  
   
   
       7 . The foil of  claim 5 , wherein said foil provides an in-plane thermal conductivity at 25 °C. of between 75 and 250 W/m·K.  
   
   
       8 . The foil of  claim 5 , wherein said foil provides an in-plane thermal conductivity at 25 °C. of between 150 and 250 W/m·K.

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