US2007111644A1PendingUtilityA1
Thick perforated polishing pad and method for making same
Est. expirySep 27, 2025(expired)· nominal 20-yr term from priority
B24B 37/26B24B 37/24B24D 18/00
35
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Claims
Abstract
A thick perforated polishing pad and method for making same which includes a polishing pad having a thick polymer sheet with multiple circular openings or perforations contained therein that are produced in the pad by machining techniques such as drilling.
Claims
exact text as granted — not AI-modified1 . A polishing pad comprising a thick polymer layer having a top surface, a bottom surface, and a plurality of openings contained therein which are drilled into the polymer layer.
2 . The polishing pad of claim 1 wherein the plurality of openings do not traverse the bottom surface of the polymer layer.
3 . The polishing pad of claim 1 wherein the thick polymer layer is comprised of a closed cell polyurethane.
4 . The polishing pad of claim 1 wherein the polymer layer has a shore hardness within a range of 40 to 80 shore D.
5 . The polishing pad of claim 1 having a thickness of 0.100 inches or greater.
6 . The polishing pad of claim 5 wherein the openings have a diameter less than or equal to 0.100 inches.
7 . The polishing pad of claim 1 further comprising one or more grooves in the top surface of the polishing pad.
8 . The polishing pad of claim 1 wherein a diameter of the openings is less than or equal to a thickness of the pad.
9 . A method for making a polishing pad comprising the steps of:
a. providing a thick polymer layer having a top surface and a bottom surface; and b. simultaneously drilling a plurality of openings into the thick polymer layer.
10 . The method of claim 9 wherein the step of simultaneously drilling a plurality of openings comprises the step of simultaneously drilling a plurality of openings into the thick polymer layer without traversing the bottom surface of the layer.
11 . The method of claim 9 wherein the step of providing a thick polymer layer comprises the step of providing a thick layer of a closed cell polyurethane.
12 . The method of claim 9 wherein the step of providing a thick polymer layer comprises the step of providing a polymer layer having a shore hardness within a range of 40 to 80 shore D.
13 . The method of claim 9 wherein the step of providing a thick polymer layer comprises the step of providing a polymer layer having a thickness of 0.100 inches or greater.
14 . The method of claim 13 wherein the step of simultaneously drilling a plurality of openings comprises the step of simultaneously drilling a plurality of openings having a diameter less than or equal to 0.100 inches.
15 . The method of claim 9 further comprising the step of cutting one or more grooves in the top surface of the thick polymer layer.
16 . The polishing pad of claim 9 wherein the step of simultaneously drilling a plurality of openings comprises the step of simultaneously drilling a plurality of openings having a diameter less than or equal to a thickness of the thick polymer layer.Join the waitlist — get patent alerts
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