Semiconductor apparatus with thin semiconductor film

Abstract

A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the thin semiconductor film to the terminal in the substrate, electrically connecting the semiconductor device to the terminal. Compared with conventional semiconductor apparatus, the invented apparatus is smaller and has a reduced material cost.

1 - 25 . (canceled)  
     
     
         26 . A semiconductor apparatus including a circuit board and a semiconductor chip mounted thereon, the semiconductor chip comprising: 
 a substrate having at least one terminal and having a substantially planarized surface;    a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed on the substantially planarized surface of the substrate, wherein an under surface of the thin semiconductor film facing the substrate is closely bonded to the substantially planarized surface of the substrate; and    an individual interconnecting line formed as a thin conductive film extending from an upper surface of the semiconductor device in the thin semiconductor film to the terminal on the substrate, electrically connecting the semiconductor device to the terminal.    
     
     
         27 . The semiconductor apparatus of  claim 26 , wherein the semiconductor chip further comprises a layer of conductive material disposed between the thin semiconductor film and the substrate, the layer of conductive material being formed on the substrate, the thin semiconductor film being bonded to the layer of conductive material, whereby the thin semiconductor film is bonded to the substrate.  
     
     
         28 . The semiconductor apparatus of  claim 26 , wherein the circuit board has a first electrode pad and the substrate of the semiconductor chip has a second electrode pad, further comprising a bonding wire electrically coupling the first electrode pad to the second electrode pad.  
     
     
         29 . The semiconductor apparatus of  claim 26 , wherein the substrate of the semiconductor chip is a semiconductor substrate having an integrated circuit formed therein, the terminal being electrically connected to the integrated circuit.  
     
     
         30 . The semiconductor apparatus of  claim 26 , comprising a plurality of semiconductor chips identical to said semiconductor chip, said semiconductor chip being one of the plurality of said semiconductor chips, said semiconductor chips being disposed on the circuit board so that their semiconductor devices are aligned at identical intervals in a single row.  
     
     
         31 . The semiconductor apparatus of  claim 26 , comprising a plurality of semiconductor chips identical to said semiconductor chip, said semiconductor chip being one of the plurality of said semiconductor chips, said semiconductor chips being disposed on the circuit board in a staggered linear array, all of the semiconductor devices in the semiconductor chips being aligned at identical intervals in a direction parallel to the staggered linear array.  
     
     
         32 . An optical printing head including the semiconductor apparatus of  claim 26 .  
     
     
         33 . The optical printing head of  claim 32 , wherein the semiconductor devices in the thin semiconductor film in the semiconductor apparatus are light-emitting elements, further including: 
 a base for supporting the semiconductor apparatus;    a rod lens array for focusing the light emitted by the light-emitting elements in the semiconductor apparatus;    a holder for holding the rod lens array; and    at least one clamp for holding the base and the holder together.    
     
     
         34 . An image-forming apparatus comprising at least one optical printing head including the semiconductor apparatus of  claim 26 .  
     
     
         35 . The image-forming apparatus of  claim 34 , further comprising: 
 a photosensitive drum selectively illuminated by the optical printing head to form a latent electrostatic image;    a developing unit for supplying toner to develop the latent electrostatic image on the photosensitive drum; and    a transfer roller for transferring the developed image from the photosensitive drum to printing media.