Semiconductor Device Having Resin Anti-Bleed Feature

Abstract

A device and a method for controlling resin bleed, the device comprising a substrate having a surface, wherein an interior region, a peripheral region, and an exterior region of the surface are generally defined. An adhesive generally resides on the surface of the substrate in the peripheral region thereof, wherein the adhesive comprises a plurality of components, such as a metal and a resin. A first barrier is formed on the surface of the substrate generally between the adhesive and the exterior region, wherein the first barrier generally prevents one or more of the plurality of components of the adhesive from bleeding onto the exterior region of the surface of the substrate.

1 - 16 . (canceled)  
   
   
       17 . A method for controlling resin bleed, the method comprising: 
 providing a substrate having a first surface, wherein the first surface is generally defined by a first porosity, and wherein a resin resides on the first surface within one or more regions; and    forming a first barrier having a second porosity over the first surface of the substrate, wherein the first barrier is formed around the one or more regions, and wherein first barrier generally prevents a flow of the resin outside of the one or more regions.    
   
   
       18 . The method of  claim 17 , wherein the second porosity is less than the first porosity.  
   
   
       19 . The method of  claim 17 , wherein forming the first barrier comprises electroplating a metal onto the first surface of the substrate.  
   
   
       20 . The method of  claim 17 , further comprising forming a second barrier having a porosity that is less than the first porosity over the first surface of the substrate, wherein the second barrier generally limits the flow of the resin to between the first barrier and the second barrier.  
   
   
       21 . A method of forming a electronic circuit device; comprising: 
 providing a substrate having a surface with an interior region, a peripheral region, and an exterior region, and a first surface porosity;    placing an integrated circuit in the interior region of the substrate;    placing an electronic circuit element in the peripheral region of the substrate;    placing a adhesive between the electronic circuit element and the substrate;    forming a first barrier of a first width and a second surface porosity over the surface of the substrate between the electronic circuit element and the exterior region; and    flowing a portion of the adhesive towards the first barrier without crossing the first width.    
   
   
       22 . The method of  claim 21 , wherein the second surface porosity is less than the first surface porosity.  
   
   
       23 . The method of  claim 21 , wherein the first barrier comprises a metal.  
   
   
       24 . The method of  claim 21 , wherein the metal is gold, silver, nickel, copper, titanium, or their alloy.  
   
   
       25 . The method of  claim 21 , wherein the forming includes electroplating.  
   
   
       26 . The method of  claim 21 , wherein the forming includes silk-screening.  
   
   
       27 . The method of  claim 21 , wherein the first barrier provides an electrical connection to an electrical ground.  
   
   
       28 . The method of  claim 21 , wherein the first barrier has a thickness less than one micron.  
   
   
       29 . The method of  claim 21 , wherein the first barrier is a ring.  
   
   
       30 . The method of  claim 21 , wherein the adhesive includes resin.  
   
   
       31 . The method of  claim 21 , wherein the substrate is ceramic.