Methods for fabricating protective layers on semiconductor device components

Abstract

Methods for packaging semiconductor device components include introducing a consolidatable material over a semiconductor device structure, and selectively consolidating the material so that contacts are exposed through the resulting package features. Selective consolidation may be effected in accordance with a program or as consolidating energy is directed toward the consolidated material.

1 . A method for packaging at least one semiconductor device component, comprising: 
 introducing unconsolidated material over a surface, including a contact-bearing surface, of at least one semiconductor device component; and    directing consolidating energy to the unconsolidated material during or after introduction thereof to at least partially consolidate the material, the act of directing being effected under control of a program, at least one contact being exposed through at least partially consolidated material formed by the act of directing.    
   
   
       2 . The method of  claim 1 , wherein directing includes causing the at least partially consolidated material to adhere to the surface.  
   
   
       3 . The method of  claim 1 , wherein introducing and directing comprise forming a polymeric structure with a substantially planar surface.  
   
   
       4 . The method of  claim 1 , wherein at least directing comprises directing consolidating energy so as to at least partially consolidate material at locations that will comprise at least a portion of an outer periphery of a package structure.  
   
   
       5 . The method of  claim 1 , further comprising: 
 consolidating unconsolidated material at least partially confined by the outer periphery of the package structure.    
   
   
       6 . The method of  claim 5 , wherein further consolidating comprises heating the at least partially consolidated material.  
   
   
       7 . The method of  claim 5 , wherein further consolidating comprises exposing the at least partially consolidated material to unfocussed radiation.  
   
   
       8 . The method of  claim 1 , wherein the acts of introducing and directing are effected over a substrate carrying a plurality of semiconductor device components.  
   
   
       9 . The method of  claim 8 , wherein the acts of introducing and directing are effected over a semiconductor substrate.  
   
   
       10 . The method of  claim 1 , further comprising: 
 securing at least one conductive structure to said at least one contact pad.    
   
   
       11 . The method of  claim 10 , wherein securing is effected before the acts of introducing and directing.  
   
   
       12 . The method of  claim 10 , wherein securing is effected after the acts of introducing and directing.  
   
   
       13 . The method of  claim 1 , wherein: 
 introducing comprises introducing a photoimageable material; and    directing comprises directing a laser beam toward the photoimageable material.    
   
   
       14 . The method of  claim 1 , wherein the acts of introducing and directing are repeated to form a structure that includes a plurality of adjacent, mutually adhered regions.  
   
   
       15 . A method for packaging at least one semiconductor device component, comprising: 
 introducing unconsolidated material over a contact-bearing surface of at least one semiconductor device component; and    programmably consolidating the unconsolidated material to form a dielectric layer on the contact-bearing surface with at least one contact exposed through the contact-bearing surface.    
   
   
       16 . The method of  claim 15 , wherein programmably consolidating includes causing the at least partially consolidated material to adhere to the surface.  
   
   
       17 . The method of  claim 15 , wherein introducing and programmably consolidating comprise forming a polymeric structure with a substantially planar surface.  
   
   
       18 . The method of  claim 15 , wherein programmable consolidating comprises at least partially consolidating material at locations that will comprise at least a portion of an outer periphery of a package structure.  
   
   
       19 . The method of  claim 15 , further comprising: 
 further consolidating unconsolidated material at least partially confined by the outer periphery of the package structure.    
   
   
       20 . The method of  claim 19 , wherein further consolidating comprises heating the at least partially consolidated material.  
   
   
       21 . The method of  claim 19 , wherein further consolidating comprises exposing the at least partially consolidated material to unfocussed radiation.  
   
   
       22 . The method of  claim 15 , wherein the acts of introducing and programmably consolidating are effected over a substrate carrying a plurality of semiconductor device components.  
   
   
       23 . The method of  claim 22 , wherein the acts of introducing and programmably consolidating are effected over a semiconductor substrate.  
   
   
       24 . The method of  claim 15 , further comprising: 
 securing at least one conductive structure to said at least one contact pad.    
   
   
       25 . The method of  claim 24 , wherein securing is effected before the acts of introducing and programmably consolidating.  
   
   
       26 . The method of  claim 24 , wherein securing is effected after the acts of introducing and programmably consolidating.  
   
   
       27 . The method of  claim 15 , wherein: 
 introducing comprises introducing a photoimageable material; and    programmably consolidating comprises directing a laser beam toward the photoimageable material.    
   
   
       28 . The method of  claim 15 , wherein the acts of introducing and programmably consolidating are repeated to form a structure that includes a plurality of adjacent, mutually adhered regions.