Detection of residual liner materials after polishing in damascene process

Abstract

A method and structure for the detection of residual liner materials after polishing in a damascene processes includes an integrated circuit comprising a substrate; a dielectric layer over the substrate; a marker layer over the dielectric layer; a liner over the marker layer and dielectric layer; and a metal layer over the liner, wherein the marker layer comprises ultraviolet detectable material, which upon excitation by an ultraviolet ray signals an absence of the metal layer and the liner over the marker layer. Moreover, the marker layer comprises a separate layer from the dielectric layer. Additionally, the ultraviolet detectable material comprises fluorescent material or phosphorescent material.

1 . An integrated circuit comprising: 
 a substrate;    a dielectric layer over said substrate;    a marker layer over said dielectric layer;    a liner over said marker layer and said dielectric layer; and    a metal layer over said liner,    wherein said marker layer comprises an ultraviolet detectable material, which upon excitation by an ultraviolet ray signals an absence of said metal layer and said liner over said marker layer.    
   
   
       2 . The integrated circuit of  claim 1 , wherein said marker layer comprises a separate layer from said dielectric layer.  
   
   
       3 . The integrated circuit of  claim 1 , wherein said ultraviolet detectable material comprises fluorescent material.  
   
   
       4 . The integrated circuit of  claim 1 , wherein said ultraviolet detectable material comprises phosphorescent material.  
   
   
       5 . An integrated circuit comprising: 
 a substrate;    a dielectric layer adjacent to said substrate;    a marker layer adjacent to said dielectric layer, wherein said marker layer comprises a separate layer from said dielectric layer;    a liner adjacent to said marker layer and said dielectric layer; and    a metal layer adjacent to said liner,    wherein said marker layer comprises an ultraviolet detectable material, which upon excitation by an ultraviolet ray signals an absence of said metal layer and said liner over said marker layer.    
   
   
       6 . The integrated circuit of  claim 5 , wherein said ultraviolet detectable material comprises fluorescent material.  
   
   
       7 . The integrated circuit of  claim 5 , wherein said ultraviolet detectable material comprises phosphorescent material.  
   
   
       8 . An integrated circuit comprising: 
 a substrate;    a dielectric layer over said substrate;    a marker layer over said dielectric layer;    a liner over said marker layer and said dielectric layer; and    a metal layer over said liner.    
   
   
       9 . The integrated circuit of  claim 8 , wherein said marker layer comprises a separate layer from said dielectric layer.  
   
   
       10 . The integrated circuit of  claim 8 , wherein said ultraviolet detectable material comprises fluorescent material.  
   
   
       11 . The integrated circuit of  claim 8 , wherein said ultraviolet detectable material comprises phosphorescent material.