Copper alloy for electric and electronic instruments

Abstract

A copper alloy for electric and electronic instruments, containing Ni of 1 to 3 mass %, Ti of 0.2 to 1.2 mass %, any one or both of Mg and Zr of 0.02 to 0.2 mass %, and Zn of 0.1 to 1 mass %, with the balance being Cu and unavoidable impurities, in which the copper alloy contains at least one of an intermetallic compound comprising Ni, Ti and Mg, an intermetallic compound comprising Ni, Ti and Zr, or an intermetallic compound comprising Ni, Ti, Mg and Zr, and the copper alloy has a stress relaxation rate of 20% or less after holding the alloy at 150° C. for 1,000 hours; and a method of producing the copper alloy for electric and electronic instruments.

1 . A copper alloy for electric and electronic instruments, comprising Ni of 1 to 3 mass %, Ti of 0.2 to 1.2 mass %, any one or both of Mg and Zr of 0.02 to 0.2 mass %, and Zn of 0.1 to 1 mass %, with the balance being Cu and unavoidable impurities, 
 wherein the copper alloy contains at least one of an intermetallic compound comprising Ni, Ti and Mg, an intermetallic compound comprising Ni, Ti and Zr, or an intermetallic compound comprising Ni, Ti, Mg and Zr, and    wherein the copper alloy has a stress relaxation rate of 20% or less after holding the alloy at 150° C. for 1,000 hours.    
   
   
       2 . The copper alloy for electric and electronic instruments according to  claim 1 , 
 wherein the intermetallic compound comprising Ni, Ti and Mg, the intermetallic compound comprising Ni, Ti and Zr, or the intermetallic compound comprising Ni, Ti, Mg and Zr has an average particle diameter in the range from 5 to 100 nm and a distribution density of from 1×10 10  to 1×10 13 /mm 2 , and    wherein the crystal grain size of a host matrix of the alloy is 10 μm or less.    
   
   
       3 . A copper alloy for electric and electronic instruments, comprising Ni of 1 to 3 mass %, Ti of 0.2 to 1.2 mass %, any one or both of Sn and Si of 0.02 to 0.2 mass %, and Zn of 0.1 to 1 mass %, with the balance being Cu and unavoidable impurities, 
 wherein the copper alloy contains at least one of an intermetallic compound comprising Ni, Ti and Sn, an intermetallic compound comprising Ni, Ti and Si, or an intermetallic compound comprising Ni, Ti, Sn and Si, and    wherein the copper alloy has a stress relaxation rate of 20% or less after holding the alloy at 150° C. for 1,000 hours.    
   
   
       4 . The copper alloy for electric and electronic instruments according to  claim 3 , 
 wherein the intermetallic compound comprising Ni, Ti and Sn, the intermetallic compound comprising Ni, Ti and Si, or the intermetallic compound comprising Ni, Ti, Sn and Si has an average particle diameter in the range from 5 to 100 nm and a distribution density of from 1×10 10  to 1×10 13 /mm 2 , and    wherein the crystal grain size of a host matrix of the alloy is 10 μm or less.    
   
   
       5 - 11 . (canceled)  
   
   
       12 . A method of producing the copper alloy for electric and electronic instruments according to  claim 1 , comprising the steps of: 
 conducting a solution heat treatment at a temperature of 850° C. or more for 35 seconds or less,    cooling from the solution heat treatment temperature to 300° C. at a cooling rate of 50° C./sec or more,    cold-rolling at a cold rolling ratio in the range of more than 0% but 50% or less, and    aging at a temperature in the range from 450 to 600° C. within 5 hours.    
   
   
       13 . A method of producing the copper alloy for electric and electronic instruments according to  claim 2 , comprising the steps of: 
 conducting a solution heat treatment at a temperature of 850° C. or more for 35 seconds or less,    cooling from the solution heat treatment temperature to 300° C. at a cooling rate of 50° C./sec or more,    cold-rolling at a cold rolling ratio in the range of more than 0% but 50% or less, and    aging at a temperature in the range from 450 to 600° C. within 5 hours.    
   
   
       14 . A method of producing the copper alloy for electric and electronic instruments according to  claim 3 , comprising the steps of: 
 conducting a solution heat treatment at a temperature of 850° C. or more for 35 seconds or less,    cooling from the solution heat treatment temperature to 300° C. at a cooling rate of 50° C./sec or more,    cold-rolling at a cold rolling ratio in the range of more than 0% but 50% or less, and    aging at a temperature in the range from 450 to 600° C. within 5 hours.    
   
   
       15 . A method of producing the copper alloy for electric and electronic instruments according to  claim 4 , comprising the steps of: 
 conducting a solution heat treatment at a temperature of 850° C. or more for 35 seconds or less,    cooling from the solution heat treatment temperature to 300° C. at a cooling rate of 50° C./sec or more,    cold-rolling at a cold rolling ratio in the range of more than 0% but 50% or less, and    aging at a temperature in the range from 450 to 600° C. within 5 hours.    
   
   
       16 . A method of producing the copper alloy for electric and electronic instruments according to  claim 1 , comprising the steps of: 
 conducting a solution heat treatment at a temperature of 850° C. or more for 35 seconds or less,    cooling from the solution heat treatment temperature to 300° C. at a cooling rate of 50° C./sec or more, and    aging at a temperature in the range from 450 to 600° C. within 5 hours.    
   
   
       17 . A method of producing the copper alloy for electric and electronic instruments according to  claim 2 , comprising the steps of: 
 conducting a solution heat treatment at a temperature of 850° C. or more for 35 seconds or less,    cooling from the solution heat treatment temperature to 300° C. at a cooling rate of 50° C./sec or more, and    aging at a temperature in the range from 450 to 600° C. within 5 hours.    
   
   
       18 . A method of producing the copper alloy for electric and electronic instruments according to  claim 3 , comprising the steps of: 
 conducting a solution heat treatment at a temperature of 850° C. or more for 35 seconds or less,    cooling from the solution heat treatment temperature to 300° C. at a cooling rate of 50° C./sec or more, and    aging at a temperature in the range from 450 to 600° C. within 5 hours.    
   
   
       19 . A method of producing the copper alloy for electric and electronic instruments according to  claim 4 , comprising the steps of: 
 conducting a solution heat treatment at a temperature of 850° C. or more for 35 seconds or less,    cooling from the solution heat treatment temperature to 300° C. at a cooling rate of 50° C./sec or more, and    aging at a temperature in the range from 450 to 600° C. within 5 hours.    
   
   
       20 . A copper alloy for electric and electronic instruments, comprising Ni of 1 to 3 mass % and Ti of 0.2 to 1.4 mass % with a ratio (Ni/Ti) of the mass percentage between Ni and Ti in the range from 2.2 to 4.7, any one or both of Mg and Zr in a total amount of 0.02 to 0.3 mass %, and Zn of 0.1 to 5 mass %, with the balance being Cu and unavoidable impurities, 
 wherein the copper alloy contains at least one of an intermetallic compound comprising Ni, Ti and Mg, an intermetallic compound comprising Ni, Ti and Zr or an intermetallic compound comprising Ni, Ti, Mg and Zr, and    wherein the copper alloy has a distribution density of the intermetallic compound in the range from 1×10 9  to 1×10 13 /mm 2 , a tensile strength of 650 MPa or more, an electric conductivity of 55% IACS or more, and a stress relaxation rate of 20% or less after holding the alloy at 150° C. for 1,000 hours.    
   
   
       21 . A copper alloy for electric and electronic instruments, comprising Ni of 1 to 3 mass % and Ti of 0.2 to 1.4 mass % with a ratio (Ni/Ti) of the mass percentage between Ni and Ti in the range from 2.2 to 4.7, any one or both of Mg and Zr in a total amount of 0.02 to 0.3 mass %, Zn of 0.1 to 5 mass %, and Sn in the range of more than 0 mass % but 0.5 mass % or less, with the balance being Cu and unavoidable impurities, 
 wherein the copper alloy contains at least one of an intermetallic compound comprising Ni, Ti and Mg, an intermetallic compound comprising Ni, Ti and Zr or an intermetallic compound comprising Ni, Ti, Mg and Zr, and    wherein the copper alloy has a distribution density of the intermetallic compound in the range from 1×10 9  to 1×10 13 /mm 2 , a tensile strength of 650 MPa or more, an electric conductivity of 55% IACS or more, and a stress relaxation rate of 20% or less after holding the alloy at 150° C. for 1,000 hours.    
   
   
       22 . A copper alloy for electric and electronic instruments, comprising Ni of 1 to 3 mass % and Ti of 0.2 to 1.4 mass % with a ratio (Ni/Ti) of the mass percentage between Ni and Ti in the range from 2.2 to 4.7, Mg of 0.02 to 0.3 mass %, Zn of 0.1 to 5 mass %, and any one or at least two of Zr, Hf, In and Ag in a total amount of more than 0 mass % but 1.0 mass % or less, with the balance being Cu and unavoidable impurities, 
 wherein the copper alloy contains at least one of an intermetallic compound comprising Ni, Ti and Mg, an intermetallic compound comprising Ni, Ti and Zr, or an intermetallic compound comprising Ni, Ti, Mg and Zr, and    wherein the copper alloy has a distribution density of the intermetallic compound in the range from 1×10 9  to 1×10 13 /mm 2 , a tensile strength of 650 MPa or more, an electric conductivity of 55% IACS or more, and a stress relaxation rate of 20% or less after holding the alloy at 150° C. for 1,000 hours.    
   
   
       23 . A copper alloy for electric and electronic instruments, comprising Ni of 1 to 3 mass % and Ti of 0.2 to 1.4 mass % with a ratio (Ni/Ti) of the mass percentage between Ni and Ti in the range from 2.2 to 4.7, Mg of 0.02 to 0.3 mass %, Zn of 0.1 to 5 mass %, Sn in the range of more than 0 mass % but 0.5 mass % or less, and any one or at least two of Zr, Hf, In and Ag in a total amount of more than 0 mass % but 1.0 mass % or less, with the balance being Cu and unavoidable impurities, 
 wherein the copper alloy contains at least one of an intermetallic compound comprising Ni, Ti and Mg, an intermetallic compound comprising Ni, Ti and Zr, or an intermetallic compound comprising Ni, Ti, Mg and Zr, and    wherein the copper alloy has a distribution density of the intermetallic compound in the range from 1×10 9  to 1×10 13 /mm 2 , a tensile strength of 650 MPa or more, an electric conductivity of 55% IACS or more, and a stress relaxation rate of 20% or less after holding the alloy at 150° C. for 1,000 hours.    
   
   
       24 . A method of producing the copper alloy for electric and electronic instruments according to  claim 20 , which comprises applying once or at least twice of heat treatment for precipitation by aging at a temperature of from 450 to 650° C. within 5 hours, 
 wherein an electric conductivity before the heat treatment for precipitation by aging is 35% IACS or less.    
   
   
       25 . A method of producing the copper alloy for electric and electronic instruments according to  claim 21 , which comprises applying once or at least twice of heat treatment for precipitation by aging at a temperature of from 450 to 650° C. within 5 hours,  
     wherein an electric conductivity before the heat treatment for precipitation by aging is 35% IACS or less.  
   
   
       26 . A method of producing the copper alloy for electric and electronic instruments according to  claim 22 , which comprises applying once or at least twice of heat treatment for precipitation by aging at a temperature of from 450 to 650° C. within 5 hours,  
     wherein an electric conductivity before the heat treatment for precipitation by aging is 35% IACS or less.  
   
   
       27 . A method of producing the copper alloy for electric and electronic instruments according to  claim 23 , which comprises applying once or at least twice of heat treatment for precipitation by aging at a temperature of from 450 to 650° C. within 5 hours, 
 wherein an electric conductivity before the heat treatment for precipitation by aging is 35% IACS or less.