Methods and apparatus for deposition of thin films

Abstract

A method for depositing a thin film includes the steps of providing a vapor including at least one selected vapor phase component into an evacuated chamber and condensing the vapor onto a heated substrate to form a liquid phase deposit wherein a temperature of the substrate is lower than the condensation temperature of the component. The liquid deposit is then cooled to produce a solid phase film. The invention can provide two or more vapor phase components. The invention can be used to deposit a wide variety of layers, including thin films of metallic, semiconductor and nonmetallic inorganic materials. The invention is useful for forming solid electrolytes and the electrodes for batteries, fuel cells and other electromagnetically active devices.

1 - 23 . (canceled)  
   
   
       24 . An apparatus for depositing a thin film for depositing uniform thin films using vapor condensation comprising: 
 a dosage device;    a substrate holding device for holding a substrate as the thin film is deposited thereon; and    a process chamber exposed to the substrate and having a pair of members telescopingly engaged with one another and movable cyclically and adiabatically with respect to one another thereby increasing and decreasing the volume of said process chamber to increase the density of the vapor as said members are contracted relative one and the other.    
   
   
       25 . An apparatus as set forth in  claim 24  wherein by said members expand and contract relative one and the other for increasing and decreasing the volume of said process chamber as the thin film is deposited on the substrate.  
   
   
       26 . An apparatus as set forth in  claim 24  including wherein said dosage device holds a powder and a chute with a needle through which the powder is introduced into said process chamber.  
   
   
       27 . An apparatus as set forth in  claim 24  including an electromagnetic lever for controlling said dosing needle.  
   
   
       28 . An apparatus as set forth in  claim 24  including a heating device for heating said process chamber with said heating device having resistive heating elements, and a shield for protecting said resistive heating elements.  
   
   
       29 . An apparatus as set forth in  claim 24  including a pipe exposed to said substrate holding device for introducing a inert gas directed to the side of the substrate.  
   
   
       30 . An apparatus as set forth in  claim 24  including a second inlet exposed into said process chamber for introducing the inert gas through a pipe over the deposited thin film.  
   
   
       31 . An apparatus as set forth in  claim 24  including a third pipe for introducing preheated gas into said process chamber.  
   
   
       32 . An apparatus as set forth in  claim 24  including a thermocouple for monitoring temperature of the substrate.  
   
   
       33 . An apparatus having a dosage device for depositing a thin film for depositing uniform thin films using vapor condensation, said apparatus comprising: 
 a substrate holding device for holding a substrate as the thin film is deposited thereon; and    a process chamber exposed to the substrate and having a pair of members telescopingly engaged with one another and movable cyclically and adiabatically with respect to one another thereby increasing and decreasing the volume of said process chamber to increase the density of the vapor as said members are contracted relative one and the other.