US2007137035A1PendingUtilityA1

Method for combining heat conductive tubes with heat dissipating fins

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Assignee: HSIEH HSIN-MAOPriority: Dec 16, 2005Filed: Dec 16, 2005Published: Jun 21, 2007
Est. expiryDec 16, 2025(expired)· nominal 20-yr term from priority
Inventors:Hsin-Mao Hsieh
B21C 37/24B23K 1/0012F28F 1/32Y10T29/4935B21C 37/22B23K 2101/14F28F 2275/06
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Claims

Abstract

A method for combining heat conductive tubes and heat dissipating fins includes the steps of positioning heat conductive tubes, extending the heat conductive tubes through holes in a very first heat dissipating fin, placing solder rings around each of the heat conductive tubes and between the heat conductive tubes and the very first heat dissipating fin, repeating the heat conductive tube extending step and the solder ring placing step until the solder rings are placed between the heat conductive tubes and a very last heat dissipating fin and heating a combination of the heat conductive tubes, the heat dissipating fins and the solder rings to melt the solder rings so as to secure engagement between the heat conductive tubes and the heat dissipating fins.

Claims

exact text as granted — not AI-modified
1 . A method for combining heat conductive tubes and heat dissipating fins, the method comprising the steps of: 
 positioning heat conductive tubes;    extending the heat conductive tubes through holes in a very first heat dissipating fin;    placing solder rings around each of the heat conductive tubes and between the heat conductive tubes and the very first heat dissipating fin;    repeating the heat conductive tube extending step and the solder ring placing step until the solder rings are placed between the heat conductive tubes and a very last heat dissipating fin; and    heating a combination of the heat conductive tubes, the heat dissipating fins and the solder rings to melt the solder rings so as to secure engagement between the heat conductive tubes and the heat dissipating fins.    
   
   
       2 . The method as claimed in  claim 1 , wherein each hole has a shoulder defined in an inner periphery defining the hole so that the solder ring is able to be rested in a corresponding shoulder.

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