Treating method for probes positioned on a test card

Abstract

A treating method for probes positioned on a test card includes several steps for plating a layer of film of various materials according to different necessities on the tips or the portions of the probes before or after the probes on the test card is used, so that the tips of the probes may be repaired and plated again and again to let the probes increase their electric conductivity or insulating property and preventing electromagnetic interference. The materials of the layer of film may be metal, metal alloy or nonmetals.

1 . A treating method for probes positioned on a test card, said treating method comprising: 
 (1) a first step of covering a test card and portions of probes not to be plated, only exposing surfaces of portions of said probes to be plated;    (2) a second step of placing said test card and said probes in a plating device; and,    (3) a third step of plating a conductive layer of film on said surfaces of said uncovered portions of said probes.    
   
   
       2 . A treating method for probes positioned on a test card, said treating method comprising: 
 (1) a first step of covering a test card and portions of probes not to be plated, only exposing surfaces of portions of said probes to be plated;    (2) a second step of placing said test card and said probes in a plating device; and,    (3) a third step of plating an insulating layer of film on said surfaces of said uncovered portions of said probes.