US2007144199A1PendingUtilityA1

Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure

37
Individually held — no corporate assignee on recordPriority: Dec 28, 2005Filed: Dec 28, 2005Published: Jun 28, 2007
Est. expiryDec 28, 2025(expired)· nominal 20-yr term from priority
Inventors:Brian Scott
H10W 40/73
37
PatentIndex Score
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Claims

Abstract

A two-phase liquid vapor enclosure is described. The enclosure includes an atomizer to spray fluid onto a heat evaporator surface. Fluid flows through a nozzle which atomizes the fluid into very small droplets. These small droplets vaporize upon reaching the heated evaporator surface. Once the vapor condenses to liquid, the liquid travels within the enclosure to recirculate to the atomizer.

Claims

exact text as granted — not AI-modified
1 . A method comprising: 
 generating heat in a microelectronic device;    emitting liquid from an atomizing module; and    transferring heat from an evaporator surface.    
   
   
       2 . The method of  claim 1 , further comprising breaking up the liquid flowing in the atomizing module.  
   
   
       3 . The method of  claim 2 , further comprising vaporizing the liquid upon reaching the evaporator surface.  
   
   
       4 . The method of  claim 3 , further comprising condensing the vaporized liquid.  
   
   
       5 . The method of  claim 4 , further comprising releasing heat.  
   
   
       6 . The method of  claim 5 , further comprising recirculating the condensed liquid to the atomizing module.  
   
   
       7 . The method of  claim 6  wherein the method occurs in a continuous loop.  
   
   
       8 . The method of  claim 6  wherein the method is part of a closed loop process.  
   
   
       9 . The method of  claim 6 , wherein the method is part of an open loop process.  
   
   
       10 . The method of  claim 1 , wherein the emitting the liquid is uniformly emitted from the atomizing module.  
   
   
       11 . A heat exchanger comprising: 
 a vapor chamber;    an evaporator coupled to the chamber; and    an atomizer module in the housing of the chamber, wherein the module to disperse liquid on the evaporator surface where the liquid absorbs heat and vaporizes.    
   
   
       12 . The heat exchanger of  claim 11  further comprising and electronic component coupled to the evaporator, wherein the electronic component to generate heat.  
   
   
       13 . The heat exchanger of  claim 12 , wherein the heat from the electronic component to heat the evaporator surface.  
   
   
       14 . The heat exchanger of  claim 11 , further comprising a condenser coupled to the chamber, wherein the vapor travels within the chamber from the evaporator to the condenser.  
   
   
       15 . The heat exchanger of  claim 14 , wherein the condenser to absorb the heat from the vapor.  
   
   
       16 . The heat exchanger of  claim 15 , wherein the vapor upon cooling, condenses into a liquid.  
   
   
       17 . The heat exchanger of  claim 11 , further comprising air side fins, wherein the fins dissipate heat from the chamber by air flow through the fins.  
   
   
       18 . The heat exchanger of  claim 11 , wherein the atomizer module is removable.  
   
   
       19 . The heat exchanger of  claim 11 , wherein the atomizer module to operate at varying frequencies.  
   
   
       20 . The heat exchanger of  claim 13 , wherein the atomizer module includes a nozzle through which the liquid flows.  
   
   
       21 . The heat exchanger of  claim 20 , wherein the nozzle includes an ultrasonic device to atomize the liquid through the nozzle.  
   
   
       22 . The heat exchange of  claim 21 , wherein the atomized liquid reaches the heated evaporator surface to absorb the heat and vaporize.  
   
   
       23 . The heat exchanger of  claim 22 , wherein the atomized liquid is about 40 microns in size.  
   
   
       24 . A atomizing module comprising: 
 a fluid inlet to intake fluid entering the module; and    a nozzle coupled to the fluid inlet, wherein the nozzle atomizes the fluid into particles,    wherein the particles are dispersed by the module to cool a heated surface.    
   
   
       25 . The atomizing module of  claim 24  wherein the nozzle includes a diaphragm to vibrate the nozzle at varying frequencies.  
   
   
       26 . The atomizing module of  claim 25 , wherein the fluid flow is atomized by the vibrations of the nozzle.  
   
   
       27 . The atomizing module of  claim 24 , wherein the particles are 40 microns in size.  
   
   
       28 . The atomizing module of  claim 24 , wherein the nozzle may disperse the particles at various angles.  
   
   
       29 . The atomizing module of  claim 24 , wherein the particles vaporize upon reaching the heat surface.

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