Methods for making temporary electronic component-carrying tapes with weakened areas

Abstract

A method for forming flexible temporary component-carrier tapes, which are used for storing, transporting and supplying components, includes forming apertures for receiving the components in a device-retaining layer, securing a top cover layer to a surface of the device-retaining layer, and securing a bottom layer to an opposite surface of the device-retaining layer. Weakened regions may be formed in one or more of the layers.

1 . A method for making a temporary component-carrying tape comprising: 
 forming a device-retaining layer;    forming a plurality of apertures in the device-retaining layer;    securing a top cover layer to a surface of the device-retaining layer so as to cover at least a portion of each of the plurality of apertures;    securing a bottom cover layer to another surface of the device-retaining layer so as to cover at least a portion of each of the plurality of apertures;    forming at least one weakened feature in the bottom cover layer after securing the bottom cover layer to another surface of the device-retaining layer; and    forming at least one weakened feature in at least one of the device-retaining layer and the top cover layer between adjacent apertures of the plurality of apertures.    
   
   
       2 . The method of  claim 1 , wherein forming the device-retaining layer comprises forming the device-retaining layer from paper, cardboard, or a thermoplastic polymer.  
   
   
       3 . The method of  claim 1 , wherein forming the device-retaining layer comprises forming the device-retaining layer from a thermoplastic polymer foam.  
   
   
       4 . The method of  claim 1 , wherein forming the device-retaining layer comprises extruding a polymeric material through a die.  
   
   
       5 . The method of  claim 1 , wherein forming the device-retaining layer comprises forming at least one series of advancement wheel holes adjacent to an edge of the device-retaining layer.  
   
   
       6 . The method of  claim 5 , wherein forming the plurality of apertures comprises punching the plurality of apertures into the device-retaining layer.  
   
   
       7 . The method of  claim 1 , wherein securing the top cover layer to the surface of the device-retaining layer comprises using a pressure-sensitive adhesive therebetween.  
   
   
       8 . The method of  claim 1 , wherein securing the top cover layer to the surface of the device-retaining layer further comprises applying heat to at least one of the top cover layer and the device-retaining layer.  
   
   
       9 . The method of  claim 1 , wherein securing the bottom cover layer to another surface of the device-retaining layer is effected with a pressure-sensitive adhesive.  
   
   
       10 . The method of  claim 1 , wherein securing the bottom cover layer to the another surface of the device-retaining layer comprises applying heat to at least one of the bottom cover layer and the device-retaining layer.  
   
   
       11 . The method of  claim 1 , wherein forming the at least one weakened feature comprises at least one of punching, cutting, etching, and creasing.  
   
   
       12 . The method of  claim 1 , wherein forming the at least one weakened feature in at least the bottom cover layer comprises at least one of punching, cutting, etching, and creasing.  
   
   
       13 . The method of  claim 1 , wherein forming the at least one weakened feature comprises forming the at least one weakened feature substantially simultaneously with forming the plurality of apertures.  
   
   
       14 . The method of  claim 1 , wherein forming the at least one weakened feature in the bottom cover layer is effected before securing the bottom cover layer to the another surface of the device-retaining layer.  
   
   
       15 . The method of  claim 1 , wherein forming the at least one weakened feature is effected prior to securing the top cover layer to the device-retaining layer.  
   
   
       16 . The method of  claim 1 , wherein forming the at least one weakened feature is effected after securing the top cover layer to the device-retaining layer.  
   
   
       17 . A method for making a temporary component-carrying tape comprising: 
 forming a device-retaining layer;    forming a plurality of apertures in the device-retaining layer;    securing a top cover layer to a surface of the device-retaining layer so as to cover at least a portion of each of the plurality of apertures; and    after securing the top cover layer to the device-retaining layer, forming at least one weakened feature in at least one of the device-retaining layer and the top cover layer between adjacent apertures of the plurality of apertures.    
   
   
       18 . The method of  claim 17 , wherein forming the device-retaining layer comprises forming the device-retaining layer from paper, cardboard, or a thermoplastic polymer.  
   
   
       19 . The method of  claim 17 , wherein forming the device-retaining layer comprises forming the device-retaining layer from a thermoplastic polymer foam.  
   
   
       20 . The method of  claim 17 , wherein forming the device-retaining layer comprises extruding a polymeric material through a die.  
   
   
       21 . The method of  claim 17 , wherein forming the device-retaining layer comprises forming at least one series of advancement wheel holes adjacent to an edge of the device-retaining layer.  
   
   
       22 . The method of  claim 21 , wherein forming the plurality of apertures comprises punching the plurality of apertures into the device-retaining layer.  
   
   
       23 . The method of  claim 17 , wherein securing the top cover layer to the surface of the device-retaining layer comprises using a pressure-sensitive adhesive therebetween.  
   
   
       24 . The method of  claim 17 , wherein securing the top cover layer to the surface of the device-retaining layer further comprises applying heat to at least one of the top cover layer and the device-retaining layer.  
   
   
       25 . The method of  claim 17 , further comprising securing a bottom cover layer to another surface of the device-retaining layer so as to cover at least a portion of each of the plurality of apertures.  
   
   
       26 . The method of  claim 25 , wherein securing the bottom cover layer to another surface of the device-retaining layer is effected with a pressure-sensitive adhesive.  
   
   
       27 . The method of  claim 25 , wherein securing the bottom cover layer to the another surface of the device-retaining layer comprises applying heat to at least one of the bottom cover layer and the device-retaining layer.  
   
   
       28 . The method of  claim 17 , wherein forming the at least one weakened feature comprises at least one of punching, cutting, etching, and creasing.  
   
   
       29 . The method of  claim 25 , further comprising forming at least one weakened feature in at least the bottom cover layer.  
   
   
       30 . The method of  claim 29 , wherein forming the at least one weakened feature in at least the bottom cover layer comprises at least one of punching, cutting, etching, and creasing.  
   
   
       31 . The method of  claim 17 , wherein forming the at least one weakened feature comprises forming the at least one weakened feature substantially simultaneously with forming the plurality of apertures.  
   
   
       32 . The method of  claim 29 , wherein forming the at least one weakened feature in the bottom cover layer is effected before securing the bottom cover layer to the another surface of the device-retaining layer.  
   
   
       33 . The method of  claim 17 , wherein forming the at least one weakened feature is effected prior to securing the top cover layer to the device-retaining layer.