Chemical mechanical polishing system

Abstract

According to one embodiment of the invention, a chemical mechanical polishing system includes a platen having a first surface adapted to couple a polishing pad thereto. The first surface includes a generally circular center portion and an annular portion surrounding the generally circular center portion. The generally circular center portion encloses an area and has an attachment surface area that is less than the area enclosed by the generally circular center portion. The attachment surface area is adapted to couple an inner portion of the polishing pad to the platen. According to one embodiment of the invention, a chemical mechanical polishing system includes a platen having a first surface coupling a polishing pad thereto. The first surface includes a generally circular center portion and an annular portion surrounding the generally circular center portion. The generally circular center portion encloses an area and has an attachment surface area that is less than the area enclosed by the generally circular center portion. The attachment surface area is coupling an inner portion of the polishing pad to the platen.

1 . A chemical mechanical polishing system, comprising: 
 a platen having a first surface, the first surface comprising a generally circular center portion and an annular portion surrounding the generally circular center portion;    the generally circular center portion having a first coating disposed outwardly therefrom, the first coating having a low surface wetting coefficient; and    the annular portion having a second coating disposed outwardly therefrom, the second coating having a high surface wetting coefficient.    
     
     
         2 . The system of  claim 1 , wherein the low surface wetting coefficient of the first coating is approximately one-half of the high surface wetting coefficient of the second coating.  
     
     
         3 . The system of  claim 1 , wherein the annular portion has a width between approximately one-half inch and approximately one inch.  
     
     
         4 . The system of  claim 1 , wherein the first and second coatings each have a thickness of between approximately ten mils and approximately twenty mils.  
     
     
         5 . The system of  claim 1 , wherein the first and second coatings are each formed from a fluoropolymer.  
     
     
         6 . The system of  claim 5 , wherein the first coating is formed from Teflon® and the second coating is formed from Halar®.