Method for testing electronic modules using board with test contactors having beam contacts

Abstract

A pass through test system for testing an electronic module includes an interface board, and test contactors movably mounted to the interface board for electrically engaging terminal contacts on the module with a zero insertion force on the modules. The interface board is configured for mounting to an automated or manual pass through test handler in electrical communication with test circuitry. In a first embodiment the interface board includes test pads in electrical communication with the test circuitry, and rotatable test contactors having spring contacts configured to simultaneously engage the test pads and the terminal contacts on the module. In a second embodiment the interface board includes test pads in electrical communication with the test circuitry, and slidable test contactors having beam leads configured to simultaneously engage the test pads and the terminal contacts on the module. In a third embodiment the test contactors are slidably mounted to the interface board, and include coiled spring contacts in electrical communication with a flex circuit. A test method includes the steps of: providing the test contactors, electrically engaging the terminal contacts on the module with a zero insertion force using the test contactors, and then applying test signals through the test contactors and the terminal contacts to the module.

1 . A method for testing an electronic module having a plurality of terminal contacts comprising: 
 providing a test circuitry configured to generate and apply test signals to the module;    providing a board comprising a plurality of contact pads in electrical communication with the test circuitry;    providing a plurality of test contactors on the board comprising a plurality of beam contacts configured for movement from a first position to a second position;    placing the module on the board with the terminal contacts aligned with the test contactors;    moving the beam contacts to electrically engage the terminal contacts and the contact pads; and    applying the test signals through the beam contacts and the terminal contacts to the module.    
   
   
       2 . The method of  claim 1  wherein the beam contacts include first portions configured to electrically engage the terminal contacts and second portions configured to electrically engage the contact pads.  
   
   
       3 . The method of  claim 1  wherein the beam contacts comprise first leaf spring portions configured to electrically engage the terminal contacts and second leaf spring portions configured to electrically engage the contact pads.  
   
   
       4 . The method of  claim 1  wherein the beam contacts comprise slidable beam leads.  
   
   
       5 . The method of  claim 1  wherein the beam contacts are configured to generate a spring force for electrically engaging the terminal contacts.  
   
   
       6 . The method of  claim 1  wherein the terminal contacts comprise planar pads.  
   
   
       7 . The method of  claim 1  wherein the module comprises an element selected from the group consisting of semiconductor memory modules, multi chip modules, semiconductor carriers, semiconductor packages, and microprocessors.  
   
   
       8 . A method for testing an electronic module having a plurality of terminal contacts comprising: 
 providing a board comprising a plurality of contacts;    providing a plurality of beam contacts on the board movable from a first position in which the terminal contacts can be aligned with the beam contacts with a zero insertion force on the module, to a second position in which the beam contacts simultaneously electrically engage the terminal contacts and the contacts, each beam contact comprising a first portion configured in the second position to electrically engage a contact on the board, and a second portion configured in the second position to electrically engage a terminal contact on the module;    placing the module on the board with the terminal contacts aligned with the test contactors;    moving the test contactors to electrically engage the terminal contacts on the module and the contacts on the board; and    applying test signals through the test contactors to the module.    
   
   
       9 . The method of  claim 8  wherein the test contactors comprise a base slidably mounted to the board.  
   
   
       10 . The method of  claim 8  wherein the test contactors comprise a molded plastic base slidably mounted to the board and the beam contacts are embedded in the molded plastic.  
   
   
       11 . The method of  claim 8  wherein the second portion is configured to penetrate the terminal contact.  
   
   
       12 . The method of  claim 8  wherein the module comprises an element selected from the group consisting of semiconductor memory modules, multi chip modules, semiconductor carriers, semiconductor packages, and microprocessors.  
   
   
       13 . A method for testing an electronic module having a plurality of terminal contacts comprising: 
 providing a test circuitry configured to generate and apply test signals to the module;    providing an interface board configured to support the module comprising a plurality of contact pads in electrical communication with the test circuitry;    providing a plurality of test contactors on the interface board movable from a first position in which the terminal contacts and the contact pads are not engaged to a second position in which the terminal contacts and the contact pads are electrically engaged, the test contactors comprising slidable beam contacts having first spring portions configured in the second position to electrically engage the contact pads and second spring portions configured in the second position to electrically engage the terminal contacts;    placing the module on the board with the terminal contacts aligned with the test contactors;    sliding the beam contacts to electrically engage the terminal contacts with the first spring portions and the contact pads with the second spring portions; and    applying test signals through the test contactors and the terminal contacts to the module.    
   
   
       14 . The method of  claim 13  wherein the first spring portions comprise first leaf springs and the second spring portions comprise second leaf springs.  
   
   
       15 . The method of  claim 13  wherein the placing step is performed with a zero insertion force on the module.  
   
   
       16 . The method of  claim 13  wherein the placing step places the module on edge on the board.  
   
   
       17 . The method of  claim 13  wherein the beam contacts are mounted to a slidable base.  
   
   
       18 . The method of  claim 13  wherein the first spring portions are configured to penetrate the contact pads.  
   
   
       19 . The method of  claim 13  wherein the second spring portions are configured to penetrate the terminal contacts.  
   
   
       20 . The method of claim  53  wherein the board includes a flex circuit in electrical communication with the test contactors and the test circuitry.