Ball grid array package

Abstract

A ball grid array package includes a substrate with a top and bottom surface. A circuit component is located on the bottom surface. The circuit component has a pair of ends. A pair of conductors are located on the bottom surface. The conductors are connected to the ends of the circuit component. A conductive epoxy covers a portion of the conductors and a portion of the bottom surface. The conductive epoxy is in electrical contact with the conductors. A ball is connected to the conductive epoxy. The conductive epoxy provides an electrical connection between the conductor and the ball. The ball is preferably copper and is subsequently coated to prevent corrosion. Other embodiments of the invention are shown in which the balls are omitted and in which the conductive epoxy is used to fill vias in a substrate.

1 . A ball grid array package comprising: 
 a) a ceramic substrate having a first and a second surface;    b) a plurality of conductors located on the second surface;    c) at least one resistor located on the second surface and connected between at least two of the conductors;    d) a plurality of conductive balls located on the second surface, at least one of the conductive balls being connected to at least one of the conductors, the conductive balls being formed substantially of copper;    e) a metal layer covering the conductive balls;    f) a conductive material providing an electrical connection between the conductor and the conductive ball; and    g) a cover coat located over the resistor and at least a portion of the conductors.    
   
   
       2 . The package according to  claim 1 , wherein the metal layer is tin.  
   
   
       3 . The package according to  claim 2 , wherein the metal layer is castin.  
   
   
       4 . A ball grid array package comprising: 
 a) a ceramic substrate having a first and a second surface;    b) a first, second and third conductor located on the second surface;    c) a first and second resistor located on the second surface, the first resistor connected between the first and second conductors and the second resistor connected between the second and third conductors;    d) a first, second and third conductive ball located on the second surface, the first conductive ball being connected to the first conductor, the second conductive ball being connected to the second conductor, the third conductive ball being connected to the third conductor, the conductive balls being formed substantially of copper;    e) a metal layer covering each of the conductive balls;    f) a first conductive material providing an electrical connection between the first conductor and the first conductive ball;    g) a second conductive material providing an electrical connection between the second conductor and the second conductive ball;    h) a third conductive material providing an electrical connection between the third conductor and the third conductive ball; and    i) a cover coat located over the resistors and at least a portion of the conductors.    
   
   
       5 . The package according to  claim 4 , wherein the metal layer is tin.  
   
   
       6 . The package according to  claim 4 , wherein the metal layer does not cover the portion of the conductive ball coupled to the conductive material.  
   
   
       7 . An electronic component comprising: 
 a) a ceramic substrate having a top surface, a bottom surface and a plurality of side surfaces;    b) a first and second conductor located on the bottom surface;    c) a first resistor located on the bottom surface, the first resistor connected between the first and second conductors;    d) a first and second conductive ball located on the bottom surface, the first conductive ball being connected to the first conductor and the second conductive ball being connected to the second conductor;    e) the conductive balls being formed substantially of copper;    f) a metal layer covering at least a portion of the first and second conductive balls;    g) a first conductive material providing an electrical connection between the first conductor and the first conductive ball;    h) a second conductive material providing an electrical connection between the second conductor and the second conductive ball;    i) a cover coat located over the resistors and at least a portion of the conductors.    
   
   
       8 . The electronic component according to  claim 7 , wherein the metal layer is tin.  
   
   
       9 . The electronic component according to  claim 7 , wherein the substrate is rectangular in shape.  
   
   
       10 . The electronic component according to  claim 7 , wherein a second cover coat covers at least a portion of the top surface.  
   
   
       11 . The electronic component according to  claim 7 , wherein the conductive balls are arranged in at least two rows.  
   
   
       12 . The electronic component according to  claim 7 , wherein the conductive balls are arranged in at least two columns.  
   
   
       13 . The electronic component according to  claim 7 , wherein at least twelve of the conductive balls are located on the bottom surface.  
   
   
       14 . The electronic component according to  claim 7 , wherein the electronic component is adapted to be mounted to a printed circuit board.