US2007166500A1PendingUtilityA1

Dicing/die bonding film and method of manufacturing the same

36
Assignee: SUTOH MANABUPriority: Dec 24, 2003Filed: Dec 7, 2004Published: Jul 19, 2007
Est. expiryDec 24, 2023(expired)· nominal 20-yr term from priority
Inventors:Manabu SutohYoshito Ushio
H10W 74/00H10W 72/075H10W 72/884H10W 90/754H10W 72/07337H10W 72/073H10W 72/354H10W 72/01331H10W 90/734H10P 72/7418H10P 72/7416H10P 72/7402H10P 72/0442H10P 72/74Y10T428/1471C09J 2203/326
36
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A dicing/die bonding sheet is made by joining a base film ( 1 ) and a silicone based adhesive agent layer ( 3 ) through the medium of an undercoat layer ( 2 ). This all-in-one dicing/die bonding sheet exhibits superior long-term storage stability and prevents chip delamination during dicing.

Claims

exact text as granted — not AI-modified
1 . A dicing/die bonding sheet adhesively bonded to a semiconductor wafer prior to the dicing of said semiconductor wafer, wherein said dicing/die bonding sheet is provided with a base film, an undercoat layer formed on said base film, and a silicone based adhesive agent layer formed on said undercoat layer and having an adhesive surface adhesively bonded to said semiconductor wafer.  
     
     
         2 . The dicing/die bonding sheet according to  claim 1 , wherein said silicone based adhesive agent layer can be stripped from said undercoat layer after bonding to said semiconductor wafer.  
     
     
         3 . The dicing/die bonding sheet according to  claim 1 , wherein said undercoat layer is a laminate made up of at least two layers.  
     
     
         4 . The dicing/die bonding sheet according to  claim 1 , wherein said base film has a surface area that is not less than said semiconductor wafer.  
     
     
         5 . The dicing/die bonding sheet according to  claim 1 , which is coated with a strippable protective layer.  
     
     
         6 . A method of preparing the dicing/die bonding sheet according to  claim 1 , which includes the step of forming the undercoat layer and the silicone based adhesive agent layer on the base film.  
     
     
         7 . The method of preparing a dicing/die bonding sheet according to  claim 1 , which includes the step of forming the silicone based adhesive agent layer and the undercoat layer on a stripping layer, the step of applying the base film to a surface of the undercoat layer, and the step of peeling off the stripping layer.  
     
     
         8 . The method of preparing a dicing/die bonding sheet according to  claim 7 , which further includes the step of forming a strippable protective layer on the silicone based adhesive agent layer after the step of peeling off the stripping layer.  
     
     
         9 . The method of preparing a dicing/die bonding sheet according to  claim 5 , which includes the step of forming the silicone based adhesive agent layer and the undercoat layer on the strippable protective layer and the step of applying the base film to a surface of the undercoat layer.  
     
     
         10 . The dicing/die bonding sheet according to  claim 2 , wherein said undercoat layer is a laminate made up of at least two layers.  
     
     
         11 . The dicing/die bonding sheet according to  claim 2 , wherein said base film has a surface area that is not less than said semiconductor wafer.  
     
     
         12 . The dicing/die bonding sheet according to  claim 3 , wherein said base film has a surface area that is not less than said semiconductor wafer.  
     
     
         13 . The dicing/die bonding sheet according to  claim 10 , wherein said base film has a surface area that is not less than said semiconductor wafer.  
     
     
         14 . The dicing/die bonding sheet according to  claim 2 , which is coated with a strippable protective layer.  
     
     
         15 . The dicing/die bonding sheet according to  claim 3 , which is coated with a strippable protective layer.  
     
     
         16 . The dicing/die bonding sheet according to  claim 4 , which is coated with a strippable protective layer.  
     
     
         17 . The dicing/die bonding sheet according to  claim 10 , which is coated with a strippable protective layer.  
     
     
         18 . The dicing/die bonding sheet according to  claim 11 , which is coated with a strippable protective layer.  
     
     
         19 . The dicing/die bonding sheet according to  claim 12 , which is coated with a strippable protective layer.  
     
     
         20 . The dicing/die bonding sheet according to  claim 13 , which is coated with a strippable protective layer.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.