Connection pad layouts

Abstract

In an implementation of connection pad layouts, a connection assembly includes a substrate assembly and connection pads disposed thereon. The connection pads form a configuration such that each connection pad is configured to align with a different terminal of an interconnect that is warped or otherwise has a non-linear alignment of terminals.

1 . A method, comprising: 
 forming a substrate assembly having conductive vias;    determining a warp variance of manufactured interconnects; and    disposing connection pads over the substrate assembly in a configuration according to the warp variance such that each of the connection pads are configured to align with a different terminal of a warped interconnect.    
   
   
       2 . A method as recited in  claim 1 , wherein disposing the connection pads over the substrate assembly includes extending one or more of the connection pads such that each of the connection pads are configured to align with a different terminal of the warped interconnect.  
   
   
       3 . A method as recited in  claim 1 , wherein disposing the connection pads includes forming the connection pads as solder pads each configured to form a soldered connection that electrically couples a terminal of the warped interconnect with a conductive via in the substrate assembly.  
   
   
       4 . A method as recited in  claim 1 , wherein forming the substrate assembly includes forming the substrate assembly as a multilayered ceramic substrate assembly.  
   
   
       5 . A method as recited in  claim 1 , wherein: 
 forming the substrate assembly includes forming the substrate assembly with at least a first surface; and    disposing the connection pads includes disposing the connection pads on the first surface of the substrate assembly such that each connection pad is configured to align with a different terminal of the warped interconnect which is warped in a direction parallel with the first surface of the substrate assembly.    
   
   
       6 . A method as recited in  claim 1 , wherein: 
 forming the substrate assembly includes forming the substrate assembly with at least a first surface; and    disposing the connection pads includes disposing the connection pads on the first surface of the substrate assembly such that each connection pad is configured to align with a different terminal of the warped interconnect which has a first end that is warped in a direction parallel with the first surface of the substrate assembly.    
   
   
       7 . A method as recited in  claim 1 , wherein: 
 forming the substrate assembly includes forming the substrate assembly with at least a first surface; and    disposing the connection pads includes disposing the connection pads on the first surface of the substrate assembly such that each connection pad is configured to align with a different terminal of the warped interconnect which has a first end and a second end that are both warped in a direction parallel with the first surface of the substrate assembly.