Method of electrolytically depositing materials in a pattern directed by surfactant distribution

Abstract

In accordance with the invention, a surface of a substrate is patterned by the steps of providing the substrate, forming a surfactant pattern on the surface and using electroless deposition or electrodeposition to deposit material on the surface in a pattern directed by the surfactant pattern. The material will preferentially deposit either under the surfactant pattern or outside the surfactant pattern depending on the material and the conditions of deposition. The surfactant pattern is conveniently formed by printing on the surface a surfactant that forms a self assembled monolayer (SAM). The method can be adapted to build complex structures in one, two and three dimensions.

1 . A method of electrolytically depositing materials on a substrate surface in a pattern comprising the steps of: 
 providing the substrate;    forming a surfactant pattern on the surface;    depositing material on the surface by electrodeposition, the material deposited in a pattern corresponding to the surfactant pattern or its complement.    
     
     
         2 . The method of  claim 1  wherein the substrate comprises a conductive, semiconductive, or insulating material.  
     
     
         3 . The method of  claim 1  wherein the substrate surface is substantially planar.  
     
     
         4 . The method of  claim 1  wherein the substrate surface is curved.  
     
     
         5 . The method of  claim 1  wherein forming the surfactant pattern comprises forming a self-assembled monolayer of surfactant.  
     
     
         6 . The method of  claim 1  wherein forming the surfactant pattern comprises contacting the surface with a surfactant-bearing stamp configured to print the pattern on the surface.  
     
     
         7 . The method of  claim 1  wherein forming the surfactant pattern comprises covering at least a portion of the surface with a continuous coating of surfactant and removing one or more portions of the continuous coating to form the pattern.  
     
     
         8 . The method of  claim 7  wherein the removing is by UV light exposure.  
     
     
         9 . The method of  claim 7  wherein the removing is by a scanning probe.  
     
     
         10 . The method of  claim 1  wherein the material is deposited on the surface in a pattern corresponding to the surfactant pattern.  
     
     
         11 . The method of  claim 6  wherein forming the surfactant pattern comprises contacting the surface a plurality of times with at least one surfactant bearing stamp.  
     
     
         12 . The method of  claim 1  further comprising at least one additional deposition in accordance with  claim 1 .  
     
     
         13 . The method of  claim 12  wherein one deposition is in the pattern of the surfactant and the other deposition is in the form of the complement of the surfactant pattern.  
     
     
         14 . The method of  claim 12  wherein the material of the additional deposition is different from the material of the first deposition.  
     
     
         15 . The method of  claim 1  wherein the depositing of material comprises selecting a deposition potential to determine whether the material is deposited in a pattern corresponding to the surfactant pattern or in a pattern corresponding to the complement of the surfactant pattern.