Antiloading compositions and methods of selecting same
Abstract
An antiloading composition includes a first organic compound. The compound has a water contact angle criterion that is less than a water contact angle for zinc stearate. The first compound also satisfies at least one condition selected from the group consisting of a melting point T melt greater than about 40° C., a coefficient of friction F less than about 0.3, and an antiloading criterion P greater than about 0.3. Another embodiment includes a second organic compound, having a different water contact angle from that of the first organic compound. The composition has a particular water contact angle W° p that is determined, at least in part, by the independent W° g of each compound and the proportion of each compound in the composition. Also, an abrasive product includes the antiloading composition. A method of grinding a substrate is disclosed that includes employing effective amount of an antiloading composition. Further disclosed is a method of selecting an antiloading compound.
Claims
exact text as granted — not AI-modified1 . A method of grinding a surface, comprising:
grinding a work surface by applying an abrasive product to the work surface to create work surface swarf; and providing an effective amount of an antiloading composition at the interface between the abrasive product and the work surface swarf; wherein: the abrasive product comprises a binder support substrate, a binder, and an abrasive material bound to the support substrate by the binder; the antiloading composition comprises a first organic compound and a second organic compound, wherein each of the first and the second organic compounds independently: has a water contact angle criterion W° g that is less than a water contact angle W° z for zinc stearate; and satisfies at least one condition selected from the group consisting of a melting point T melt greater than about 40° C., a dynamic coefficient of friction F less than about 0.4, and an antiloading criterion P greater than about 0.2, and wherein the first and the second compounds are different, and wherein each of the first and second organic compounds independently is represented by the formula R—OSO 3 − M + , RCONH(CH 2 ) 3 N+(CH 3 ) 2 CH 2 COO—, R—CONR′CH 2 CO 2 − M + , or R—O(CO)CH 2 OSO 3 − M + , wherein R is C6-C18 linear alkyl; R′ is C1-C4 linear alkyl; and M + is an alkali metal ion.
2 . The method of claim 1 , wherein at least one of the first and the second compound has a W° g less than about 100° and satisfies at least one condition selected from the group consisting of T melt greater than about 70° C., F less than about 0.4, and P greater than about 0.2.
3 . The method of claim 1 , wherein at least one of the first and the second compound has a W° g less than about 70° and satisfies at least one condition selected from the group consisting of T melt greater than about 90° C., F less than about 0.3, and P greater than about 0.3.
4 . The method of claim 3 , wherein the first compound:
satisfies each condition T melt , F, and P, wherein T melt is greater than about 90° C., F is less than about 0.3, and P is greater than about 0.3; and is R—OSO 3 − M + , RCONH(CH 2 ) 3 N+(CH 3 ) 2 CH 2 COO—, R—CONR′CH 2 CO 2 − M + , or R—O(CO)CH 2 OSO 3 − M + , wherein R is C6-C18 linear alkyl; R′ is C1-C4 linear alkyl; and M + is an alkali metal ion.
5 . The abrasive product of claim 1 , wherein W° g for at least one of the first and the second compound is about 0°.
6 . The method of claim 1 , wherein at least one of the first and the second compound is selected from the group consisting of sodium lauryl sulfate, sodium decyl sulfate, sodium octyl sulfate, sodium lauroyl sarcosinate, lauramidopropyl betaine, and sodium lauryl sulfoacetate.
7 . The method of claim 6 , wherein either the first or the second organic compound is sodium lauryl sulfate.
8 . The method of claim 1 , further comprising grinding the surface to a particular water contact angle W° p and when the second organic compound has a W° g different from that of the first compound, and wherein W° p is determined, at least in part, by the independent W° g of each compound and the proportion of each compound employed.
9 . The method of claim 8 , further comprising selecting W° p for compatibility with a coating to be applied to the ground work surface.
10 . The method of claim 8 , wherein the step of providing the antiloading composition comprises applying at least one compound to the abrasive product or the work surface.
11 . The method of claim 8 , wherein the abrasive product comprises at least one of the compounds.
12 . A method of grinding a surface, comprising:
grinding a work surface by applying an abrasive product to the work surface to create work surface swarf; and providing an effective amount of an antiloading composition at the interface between the abrasive product and the work surface swarf; wherein: the abrasive product comprises a binder support substrate, a binder, and an abrasive material bound to the support substrate by the binder; the antiloading composition comprises a lauryl sulfate in an amount that reduces the accumulation of swarf during grinding.
13 . The method of claim 12 , wherein the lauryl sulfate is sodium lauryl sulfate.
14 . A method of grinding a surface, comprising:
grinding a work surface by applying an abrasive product to the work surface to create work surface swarf; and providing an effective amount of an antiloading composition at the interface between the abrasive product and the work surface swarf; wherein: the abrasive product comprises a binder support substrate, a binder, and an abrasive material bound to the support substrate by the binder; the antiloading composition comprising a lauryl sulfate, wherein the lauryl sulfate is the only organic antiloading compound included in the antiloading composition.
15 . The abrasive product of claim 14 , wherein the lauryl sulfate is sodium lauryl sulfate.Join the waitlist — get patent alerts
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