Chemical mechanical polishing pad with micro-holes

Abstract

Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with micro-holes each having a desired cross-sectional area while having a desired depth. The shape, size, and density of the micro-holes can be optionally adjusted. The chemical mechanical polishing pad provides an effect of maintaining a desired polishing rate during a polishing process. In accordance with the present invention, the micro-holes can have diverse arrangements depending on given process conditions.

1 . A chemical mechanical polishing pad formed, at a polishing surface thereof, with micro-holes each having a circular cross-section and a uniform cross-sectional area, 
 wherein each of the micro-holes has a depth ranging from 0.01 of the thickness of the polishing pad but smaller than at least the thickness of the polishing pad.    
     
     
         2 . The chemical mechanical polishing pad according to  claim 1 , wherein the cross-sectional area of each of the micro-holes ranges from 10 μm 2  to 10 mm 2 .  
     
     
         3 . The chemical mechanical polishing pad according to  claim 1 , wherein each of the micro-holes extends in a direction perpendicular to or inclined from the polishing surface.  
     
     
         4 . The chemical mechanical polishing pad according to  claim 1 , wherein the pad is divided into at least two micro-hole regions where the micro-holes are distributed while having different cross-sectional areas, different shapes, and/or different densities, respectively.  
     
     
         5 . The chemical mechanical polishing pad according to  claim 2 , wherein the pad is divided into at least two micro-hole regions where the micro-holes are distributed while having different cross-sectional areas, different shapes, and/or different densities, respectively.  
     
     
         6 . The chemical mechanical polishing pad according to  claim 3 , wherein the pad is divided into at least two micro-hole regions where the micro-holes are distributed while having different cross-sectional areas, different shapes, and/or different densities, respectively.  
     
     
         7 . The chemical mechanical polishing pad according to  claim 1 , wherein the micro-holes are formed by a laser.  
     
     
         8 . The chemical mechanical polishing pad according to  claim 2 , wherein the micro-holes are formed by a laser.  
     
     
         9 . The chemical mechanical polishing pad according to  claim 3 , wherein the micro-holes are formed by a laser.