Mini-environment pod device, an exposure apparatus and a device manufacturing method using the same

Abstract

A pod attachable to an outside surface of a grounded electromagnetic-shielded chamber. The chamber has a door and a flange portion, around the door, on the outside surface and contains a micro-device manufacturing apparatus. The pod includes walls configured to contain a substrate and having an opening, the walls including a flange portion configured to contact the flange portion of the chamber, and a lid configured to openably close the opening, the substrate being transferred between the pod and the chamber through the opening. Also included is an electromagnetic shield member. The electromagnetic shield member is arranged over the walls and on the flange portion of the walls. The electromagnetic shield member on the flange portion of the walls is configured to contact the grounded flange portion of the chamber while the pod is attached to the outside surface.

1 - 20 . (canceled)  
   
   
       21 . An improved pod attachable to an outside surface of a grounded electromagnetic-shielded chamber, the chamber having a door and a flange portion, around the door, on the outside surface and containing a micro-device manufacturing apparatus, said pod including: 
 walls configured to contain a substrate and having an opening, said walls including a flange portion configured to contact the flange portion of the chamber; and    a lid configured to openably close the opening, the substrate is being transferred between said pod and the chamber through the opening, the improvement comprising:    an electromagnetic shield member, said electromagnetic shield member being arranged over said walls and on the flange portion of said walls, said electromagnetic shield member on the flange portion of said walls being configured to contact the grounded flange portion of the chamber while said pod is attached to the outside surface.    
   
   
       22 . A pod according to  claim 21 , wherein said lid is arranged in a front of said pod.  
   
   
       23 . A pod according to  claim 21 , wherein said lid is arranged in a bottom of said pod.  
   
   
       24 . A pod according to  claim 21 , wherein said electromagnetic shield member comprises wire mesh arranged on or within said walls.  
   
   
       25 . A pod according to  claim 21 , wherein said electromagnetic shield member comprises metal coatings arranged on said walls.  
   
   
       26 . A pod according to  claim 21 , wherein said electromagnetic shield member comprises electromagnetic-shield materials arranged in said walls.  
   
   
       27 . An improved micro-device manufacturing apparatus including: 
 a grounded electromagnetic-shielded chamber having a door and a flange portion around said door on an outside surface of said chamber;    a transfer unit, arranged in said chamber and configured to transfer a substrate between said chamber and a pod, the pod being attached to the outside surface and having an electromagnetic shield member which includes a flange portion configured to contact said flange portion of said chamber; and    a processing unit, arranged in said chamber, and configured to process the substrate transferred into said chamber from the pod by said transfer unit, improved in that:    said flange portion of said chamber is grounded and configured to contact the flange portion of the electromagnetic shield member of the pod while the pod is attached to the outside surface.    
   
   
       28 . An apparatus according to  claim 27 , wherein said transfer unit is configured to transfer the substrate between said chamber and the pod through said door.  
   
   
       29 . An apparatus according to  claim 27 , wherein said processing unit is configured to expose the substrate to a pattern.  
   
   
       30 . An apparatus according to  claim 27 , wherein a lid of the pod is arranged in a front of the pod.  
   
   
       31 . An apparatus according to  claim 27 , wherein a lid of the pod is arranged in a bottom of the pod.  
   
   
       32 . An apparatus according to  claim 27 , wherein the pod includes walls configured to contain the substrate and having an opening, and a lid configured to openably close the opening, the substrate being transferred by said transfer unit through the opening, the walls including the flange portion of the pod, the electromagnetic shield member being arranged over the walls and on the flange portion of the walls.