Apparatus, system, and method for thermal conduction interfacing

Abstract

An apparatus, system, and method are disclosed for thermal conduction interfacing. The apparatus for thermal conduction interfacing is provided with a first layer formed substantially of a pliable thermally conductive material. The apparatus includes a second layer formed substantially of a pliable thermally conductive material and coupled at the edges to the first layer forming a pliable packet, wherein the first layer and the second layer conform to a set of thermal interface surfaces. Additionally, the apparatus includes a plurality of thermally conductive particles disposed within the packet, wherein thermal energy is transferred from the first layer to the second layer through the thermally conductive particles. Beneficially, such an apparatus, system, and method would provide effective thermal coupling between a heat generating device and a heat dissipating device. Additionally, the apparatus, system, and method would be modular, reusable, and easy to install or replace without a significant mess.

1 . An apparatus for thermal conduction interfacing, the apparatus comprising: 
 a first layer formed substantially of a pliable thermally conductive material;    a second layer formed substantially of a pliable thermally conductive material and coupled at the edges to the first layer forming a pliable packet, wherein the first layer and the second layer conform to a set of thermal interface surfaces; and    a plurality of thermally conductive particles disposed within the packet, wherein thermal energy is transferred from the first layer to the second layer through the thermally conductive particles.    
   
   
       2 . The apparatus of  claim 1 , further comprising a mechanism for application of force on the first and second layers, the thermally conductive particles, and the thermal interface surfaces.  
   
   
       3 . The apparatus of  claim 2 , wherein the mechanism further comprises rounded packet edges to provide a spring member for application of force.  
   
   
       4 . The apparatus of  claim 1 , wherein the first and the second layers are further configured to conform to an uneven interface surface and substantially fill air gaps between the thermal interface surfaces when force is applied.  
   
   
       5 . The apparatus of  claim 1 , wherein the thermally conductive particles are structurally compliant forming a semisolid thermally conductive structure within the packet when force is applied.  
   
   
       6 . The apparatus of  claim 5 , wherein the thermally conductive particles are structurally resilient, making the apparatus reusable.  
   
   
       7 . The apparatus of  claim 1 , wherein the thermally conductive particles are sized in a range between about 0.001 inches and about 0.005 inches.  
   
   
       8 . A system for thermal conduction interfacing, the system comprising: 
 a heat generating device;    a heat dissipating device;    a thermal conduction interface packet comprising 
 a first layer formed substantially of a pliable thermally conductive material,  
 a second layer formed substantially of a pliable thermally conductive material and coupled at the edges to the first layer forming a pliable packet, and  
 a plurality of thermally conductive particles disposed within the packet; and  
   wherein the first layer conforms to the surface of the heat generating device, the second layer conforms to the surface of the heat dissipating device, and thermal energy is transferred from the first layer to the second layer through the thermally conductive particles.    
   
   
       9 . The system of  claim 8 , wherein the heat generating device is an electronic component package and the heat dissipating device is a heatsink.  
   
   
       10 . The system of  claim 8 , further comprising a mechanism for application of force perpendicular to the thermal interface surfaces of the heat generating device, the heat dissipating device, and the thermal conduction interface packet.  
   
   
       11 . The system of  claim 8 , wherein the thermal conduction interface packet further comprises rounded edges to provide a spring member for application of force within the system.  
   
   
       12 . The system of  claim 8 , wherein the thermal conduction interface packet is further configured to conform to an uneven interface surface and substantially fill air gaps between the surfaces of the heat generating device and the heat dissipating device when force is applied.  
   
   
       13 . The system of  claim 8 , wherein the thermally conductive particles are structurally compliant forming a semisolid thermally conductive structure within the packet when force is applied.  
   
   
       14 . The system of  claim 13 , wherein the thermally conductive particles are structurally resilient making the thermal conduction interface packet reusable.  
   
   
       15 . A method for thermal conduction interfacing, the method comprising: 
 providing a first layer formed substantially of a pliable thermally conductive material;    coupling a second layer, formed substantially of a pliable thermally conductive material, to the edges of the first layer forming a pliable packet, wherein the first layer and the second layer conform to a set of thermal interface surfaces; and    inserting a plurality of thermally conductive particles into the packet, wherein thermal energy is transferred from the first layer to the second layer through the thermally conductive particles.    
   
   
       16 . The method of  claim 15 , wherein the method further comprises providing rounded packet edges to act as a spring member for facilitating the application of force on the thermal interface surfaces and the packet.  
   
   
       17 . The method of  claim 15 , wherein the method further comprises placing the packet between the thermal interface surfaces of an electronic component package and a heatsink.  
   
   
       18 . The method of  claim 16 , wherein the method further comprises applying a perpendicular force to the thermal interface surfaces and the packet, wherein the first and the second layer are further configured to conform to an uneven interface surface and substantially fill air gaps between the thermal interface surfaces when force is applied.  
   
   
       19 . The method of  claim 18 , wherein the method further comprises transferring thermal energy through a semisolid thermally conductive structure formed within the packet when force is applied.  
   
   
       20 . The method of  claim 15 , wherein the method further comprises reusing the packet to facilitate efficient thermal conduction between a plurality of sets of thermal interface surfaces.