Method For Electrochemical Fabrication

Abstract

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

1 . A method for fabricating a multi-layer three-dimensional structure, comprising: 
 (i) forming a first layer, comprising: 
 a) providing a first mask in contact with a substrate, wherein the mask has a first pattern of openings therein;  
 b) depositing a first pattern of a first material from a source of the first material onto said substrate using the first mask to form a portion of a first layer, wherein the first material comprises a sacrificial material or a structural material;  
 c) removing the first mask from the substrate;  
 d) depositing a second material onto the substrate, wherein the second material comprises the other of a structural material or a sacrificial material;  
   (ii) building additional layers adjacent to and adhered to previously formed layers; and    (iii) removing undesired elements of structural material from at least the first layer via etching or electropolishing.    
     
     
         2 . The method of  claim 1  wherein the first material is a first metal.  
     
     
         3 . The method of  claim 2  wherein the second material is a second metal.  
     
     
         4 . The method of  claim 3  wherein the first metal is the sacrificial material and the second metal is the structural material.  
     
     
         5 . The method of  claim 4  wherein the undesired elements of the second metal are removed via chemical etching.  
     
     
         6 . The method of  claim 4  wherein the undesired elements of the second metal are removed via electropolishing.  
     
     
         7 . The method of  claim 3  wherein the first metal is the structural material and the second metal is the sacrificial material.  
     
     
         8 . The method of  claim 7  wherein the undesired elements of the first metal are removed via chemical etching.  
     
     
         9 . The method of  claim 7  wherein the undesired elements of the first metal are removed via electropolishing.  
     
     
         10 . The method of  claim 1  wherein the forming of the first layer comprises removing a portion of at least one of the deposited materials.  
     
     
         11 . The method of  claim 10  wherein the removing is performed during a process of planarizing a surface of the first layer.  
     
     
         12 . The method of  claim 1  wherein the first material comprises a sacrificial material and the second material comprises a structural material, and wherein the method additionally comprises: 
 (iii) releasing the structural material from the sacrificial material after formation of the multi-layer structure.    
     
     
         13 . The method of  claim 1  wherein the first material comprises a structural material and the second material comprises a sacrificial material, and wherein the method additionally comprises: 
 (iii) releasing the structural material from the sacrificial material after formation of the multi-layer structure.    
     
     
         14 . A method for fabricating a multi-layer three-dimensional structure, comprising: 
 (i) forming a first layer, comprising: 
 a) providing a first mask in contact with a substrate, wherein the mask has a first pattern of openings therein;  
 b) depositing a first pattern of a first material from a source of the first material onto said substrate using the first mask to form a portion of a first layer;  
 c) removing the first mask from the substrate;  
 d) providing a second mask in contact with the substrate, and/or first material, wherein the mask has a second pattern of openings therein;  
 e) etching a void, having a second pattern, into the substrate and/or the first material using the second mask;  
 f) removing the second mask from the substrate and/or first material;  
 g) depositing a second material into the void; and  
   (ii) building layers adjacent to and adhered to previously formed layers,    wherein at least one of first or second materials is a structural material and removing an undesired portion of the structural material via an etching or electropolishing operation.    
     
     
         15 . The method of  claim 14  wherein the first material is a first metal.  
     
     
         16 . The method of  claim 15  wherein the second material is a second metal.  
     
     
         17 . The method of  claim 16  wherein the first metal is the sacrificial material and the second metal is the structural material.  
     
     
         18 . The method of  claim 17  wherein the undesired elements of the second metal are removed via chemical etching.  
     
     
         19 . The method of  claim 16  wherein the undesired elements of the second metal are removed via electropolishing.  
     
     
         20 . The method of  claim 15  wherein the first metal is the structural material and the second metal is the sacrificial material.  
     
     
         21 . The method of  claim 20  wherein the undesired elements of the first metal are removed via chemical etching.  
     
     
         22 . The method of  claim 20  wherein the undesired elements of the first metal are removed via electropolishing.  
     
     
         23 . The method of  claim 14  wherein the forming of the first layer comprises removing a portion of at least one of the deposited materials.  
     
     
         24 . The method of  claim 23  wherein the removing is performed during a process of planarizing a surface of the first layer.  
     
     
         25 . The method of  claim 14  wherein the first material comprises a sacrificial material and the second material comprises a structural material, and wherein the method additionally comprises: 
 (iii) releasing the structural material from the sacrificial material after formation of the multi-layer structure.    
     
     
         26 . The method of  claim 14  wherein the first material comprises a structural material and the second material comprises a sacrificial material, and wherein the method additionally comprises: 
 (iii) releasing the structural material from the sacrificial material after formation of the multi-layer structure.