Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor

Abstract

A mounting substrate includes an imprinted structure on one side for containing electrical bumps. The imprinted structure is imprinted and also cured under conditions that allow retention of significant features of the cured polymer film. A chip package is also made of the imprinted structure. A computing system is also disclosed that includes the imprinted structure.

1 - 26 . (canceled)  
     
     
         27 . A structure comprising: 
 a substrate;    an imprinted, cured polymer film disposed above the substrate, the polymer having a recess; and    an electrical bump disposed in the recess.    
     
     
         28 . The structure of  claim 27  further including: 
 an electronic device electrically coupled to the structure through the electrical bump.    
     
     
         29 . The structure of  claim 27 , further including: 
 an electronic device electrically coupled to the structure, wherein the structure is disposed in one of a computer, a wireless communicator, a hand-held device, an automobile, a locomotive, an aircraft, a watercraft, and a spacecraft.    
     
     
         30 . The structure of  claim 27  wherein the imprinted polymer has a convex over-all profile.  
     
     
         31 . The structure of  claim 27  wherein the polymer is a resin that comprises a filler selected from silica, ceria, thoria, zirconia and combinations thereof.  
     
     
         32 . The structure of  claim 27  wherein the polymer is a resin that comprises a filler selected from silica, ceria, thoria, zirconia and combinations thereof, and wherein the filler is selected from a spherical particle, an aspherical particle, a fiber, and combinations thereof.  
     
     
         33 . The structure of  claim 27  wherein the polymer film is selected from a resin, an expoxy, and combinations thereof.  
     
     
         34 . The structure of  claim 27  wherein the polymer film has a film-to-substrate thickness ratio in a range from about one-tenth to about one-half the thickness of the substrate.  
     
     
         35 . The structure of  claim 27  wherein the polymer film comprises a contoured recess.