Apparatus and method for manufacturing semiconductor device

Abstract

The manufacturing apparatus of a semiconductor device includes a jig having a plurality of holders arranged in a row, a controller for controlling the pitch of the plurality of holders arranged in a row, a support means provided with a plurality of semiconductor integrated circuits, and a support means provided with a substrate having a plurality of elements. By mounting the semiconductor integrated circuits on the respective elements by using the jig having the plurality of holders arranged in a row, semiconductor devices are manufactured.

1 . A manufacturing apparatus of a semiconductor device, comprising:
 a first support means provided with a plurality of semiconductor integrated circuits;   a second support means provided with a substrate having a plurality of elements, and   a jig comprising:
 a plurality of holders arranged in a row for catching and holding the plurality of semiconductor integrated circuits, picking up the plurality of semiconductor integrated circuit provided over the first support means, and mounting the plurality of semiconductor integrated circuit on the plurality of respective elements provided over the second support means; and 
 a controller for controlling a pitch of the plurality of holders. 
   
   
   
       2 . The manufacturing apparatus of a semiconductor device according to  claim 1 , wherein the controller moves the plurality of holders arranged in a row so that connection terminals of the plurality of semiconductor integrated circuits are positioned opposite respective connection terminals of the plurality of elements. 
   
   
       3 . The manufacturing apparatus of a semiconductor device according to  claim 1 , wherein each of the first support means and the second support means is a stage, a belt conveyor, or a robot arm. 
   
   
       4 . The manufacturing apparatus of a semiconductor device according to  claim 1 ,
 wherein the first support means is a stage, a belt conveyor, or a robot arm; and   wherein the second support means is a set of a roller for supplying a flexible substrate having the plurality of elements and a roller for winding up the flexible substrate having the plurality of elements.   
   
   
       5 . A manufacturing apparatus of a semiconductor device, comprising:
 a support means provided with a plurality of semiconductor integrated circuits;   a plurality of holders for catching and holding the plurality of semiconductor integrated circuits;   a first roller on which the plurality of holders are arranged in a row a controller for controlling a pitch of the plurality of holders;   a second roller for supplying a flexible substrate having a plurality of elements;   a third roller for controlling a movement of the flexible substrate having the plurality of elements; and   a fourth roller for winding up the flexible substrate having the plurality of elements,   wherein the first roller picks up the plurality of semiconductor integrated circuits provided over the first support means by using the plurality of holders, and then the plurality of semiconductor integrated circuits are mounted on the plurality of respective elements by using the second roller.   
   
   
       6 . A manufacturing apparatus of a semiconductor device, comprising:
 a support means provided with a plurality of semiconductor integrated circuits;   a plurality of holders for catching and holding the plurality of semiconductor integrated circuits;   a first roller on which the plurality of holders are arranged in a row;   a controller for controlling a pitch of the plurality of holders;   a second roller for supplying a flexible substrate having a plurality of elements;   a third roller for controlling a movement of the flexible substrate having the plurality of elements; and   a cutter for cutting the flexible substrate having the plurality of elements,   wherein the first roller picks up the plurality of semiconductor integrated circuits provided over the support means by using the plurality of holders, and then the plurality of semiconductor integrated circuits are mounted on the plurality of respective elements by using the second roller; and   wherein the cutter cuts the flexible substrate having the plurality of elements on which the plurality of semiconductor integrated circuits are mounted.   
   
   
       7 . A manufacturing apparatus of a semiconductor device, comprising:
 a support means provided with a plurality of semiconductor integrated circuits;   a plurality of holders for catching and holding the plurality of semiconductor integrated circuits;   a first roller on which the plurality of holders are arranged in a row;   a controller for controlling a pitch of the plurality of holders;   a second roller for supplying a first flexible substrate having a plurality of elements;   a third roller for controlling a movement of the first flexible substrate having the plurality of elements;   a fourth roller for supplying a second flexible substrate; and   a pair of a fifth roller and a sixth roller which attach the first flexible substrate having the plurality of elements, the plurality of semiconductor integrated circuits, and the second flexible substrate, to each other,   wherein the first roller picks up the plurality of semiconductor integrated circuits provided over the support means by using the plurality of holders, and then the plurality of semiconductor integrated circuits are mounted on the plurality of respective elements by using the second roller; and   wherein the pair of the fifth roller and the sixth roller attach the second flexible substrate to the first flexible substrate having the plurality of elements on which the plurality of semiconductor integrated circuits are mounted.   
   
   
       8 . The manufacturing apparatus of a semiconductor device according  claim 5 , wherein the first roller has 2n sets of holders. 
   
   
       9 . The manufacturing apparatus of a semiconductor device according to  claim 6 , wherein the first roller has 2n sets of holders. 
   
   
       10 . The manufacturing apparatus of a semiconductor device according to  claim 7 , wherein the first roller has 2n sets of holders. 
   
   
       11 . The manufacturing apparatus of a semiconductor device according to  claim 5 , wherein the first roller has (2n+1) sets of holders. 
   
   
       12 . The manufacturing apparatus of a semiconductor device according to  claim 6 , wherein the first roller has (2n+1) sets of holders. 
   
   
       13 . The manufacturing apparatus of a semiconductor device according to  claim 7 , wherein the first roller has (2n+1) sets of holders. 
   
   
       14 . A manufacturing apparatus of a semiconductor device, comprising:
 a support means provided with a plurality of semiconductor integrated circuits;   a plurality of first holders for catching and holding the plurality of semiconductor integrated circuits;   a first roller on which the plurality of first holders are arranged in a row;   a controller for controlling a pitch of the plurality of first holders;   a plurality of second holders for catching and holding the plurality of semiconductor integrated circuits from the plurality of first holders;   a second roller on which the plurality of second holders are arranged in a row;   a third roller for supplying a flexible substrate having a plurality of elements;   a fourth roller for controlling a movement of the flexible substrate having the plurality of elements; and   a fifth roller for winding up the flexible substrate having the plurality of elements,   wherein the second roller catches and holds the plurality of semiconductor integrated circuits which have been caught and held by the first holders, by using the plurality of second holders, and then the plurality of semiconductor integrated circuits are mounted on the plurality of respective elements by using the fourth roller.   
   
   
       15 . The manufacturing apparatus of a semiconductor device according to  claim 14 , wherein each of the first roller and the second roller has 2n sets of first holders and 2n sets of second holders. 
   
   
       16 . The manufacturing apparatus of a semiconductor device according to  claim 14 , wherein each of the first roller and the second roller has (2n+1) sets of first holders and (2n+1) sets of second holders. 
   
   
       17 . The manufacturing apparatus of a semiconductor device according to  claim 1 , wherein the element includes at least one of an antenna, a semiconductor integrated circuit, and a sensor. 
   
   
       18 . The manufacturing apparatus of a semiconductor device according to  claim 5 , wherein the element includes at least one of an antenna, a semiconductor integrated circuit, and a sensor. 
   
   
       19 . The manufacturing apparatus of a semiconductor device according to  claim 6 , wherein the element includes at least one of an antenna, a semiconductor integrated circuit, and a sensor. 
   
   
       20 . The manufacturing apparatus of a semiconductor device according to  claim 7 , wherein the element includes at least one of an antenna, a semiconductor integrated circuit, and a sensor. 
   
   
       21 . The manufacturing apparatus of a semiconductor device according to  claim 14 , wherein the element includes at least one of an antenna, a semiconductor integrated circuit, and a sensor. 
   
   
       22 . A manufacturing method of a semiconductor device, comprising the steps of:
 setting a plurality of semiconductor integrated circuits on a first support means;   picking up the plurality of semiconductor integrated circuits from the first support means by using a plurality of holders arranged in a row on a jig;   controlling a pitch of the plurality of holders by a controller for controlling the pitch of the plurality of holders so that connection terminals of the plurality of semiconductor integrated circuits are positioned opposite respective connection terminals of a plurality of elements over a substrate which is provided over a second support means; and   connecting the connection terminals of the plurality of semiconductor integrated circuits to the respective connection terminals of the plurality of elements.   
   
   
       23 . A manufacturing method of a semiconductor device, comprising the steps of:
 setting a plurality of semiconductor integrated circuits on a support means;   picking up the plurality of semiconductor integrated circuits by using a plurality of holders arranged in a row on a roller;   rotating a roller for supplying a flexible substrate having a plurality of elements, a roller for controlling a movement of the flexible substrate having the plurality of elements, and a roller for collecting the flexible substrate having the plurality of elements, thereby moving the flexible substrate having the plurality of elements;   rotating the roller on which the plurality of holders are arranged in a row, so that the plurality of semiconductor integrated circuits are positioned opposite the flexible substrates having the plurality of elements;   controlling a pitch of the plurality of holders by a controller for controlling the pitch of the plurality of holders so that connection terminals of the plurality of semiconductor integrated circuits are positioned opposite respective connection terminals of the plurality of elements over the flexible substrate; and   connecting the connection terminals of the plurality of semiconductor integrated circuits to the respective connection terminals of the plurality of elements by using the roller for controlling the movement of the flexible substrate having the plurality of elements and the roller on which the plurality of holders are arranged in a row.   
   
   
       24 . The manufacturing apparatus of a semiconductor device according to  claim 23 , further comprising the step of:
 cutting the flexible substrate by a cutter, after connecting the connection terminals of the plurality of semiconductor integrated circuits to the respective connection terminals of the plurality of elements by using the roller for controlling the movement of the flexible substrate having the plurality of elements and the roller on which the plurality of holders are arranged in a row.   
   
   
       25 . The manufacturing apparatus of a semiconductor device according to  claim 23 , further comprising the step of:
 attaching another flexible substrate to surfaces of the plurality of semiconductor integrated circuits and the plurality of elements by using a pair of rollers, after connecting the connection terminals of the plurality of semiconductor integrated circuits to the respective connection terminals of the plurality of elements by using the roller for controlling the movement of the flexible substrate having the plurality of elements and the roller on which the plurality of holders are arranged in a row.   
   
   
       26 . The manufacturing apparatus of a semiconductor device according to  claim 23 , further comprising the steps of:
 attaching another flexible substrate to surfaces of the plurality of semiconductor integrated circuits and the plurality of elements by using a pair of rollers, after connecting the connection terminals of the plurality of semiconductor integrated circuits to the respective connection terminals of the plurality of elements by using the roller for controlling the movement of the flexible substrate having the plurality of elements and the roller on which the plurality of holders are arranged in a row; and   cutting the flexible substrate having the plurality of elements and the other flexible substrate by a cutter.   
   
   
       27 . The manufacturing apparatus of a semiconductor device according to claim  22 , wherein the element includes at least one of an antenna, a semiconductor integrated circuit, and a sensor. 
   
   
       28 . The manufacturing apparatus of a semiconductor device according to  claim 23 , wherein the element includes at least one of an antenna, a semiconductor integrated circuit, and a sensor.