Quasi-radial heatsink with rectangular form factor and uniform fin length

Abstract

In some embodiments, a heatsink includes a thermally conductive core and at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length, and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular cross sectional form factor. Other embodiments are disclosed and claimed.

1 . An apparatus, comprising: 
 a thermally conductive core; and    at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length,    and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular form factor.    
   
   
       2 . The apparatus of  claim 1 , wherein the fins having uniform length also have uniform thickness profiles.  
   
   
       3 . The apparatus of  claim 2 , wherein the fins having uniform length and thickness profiles also have uniform tip-to-tip spacing.  
   
   
       4 . The apparatus of  claim 2 , wherein the fins having uniform length and thickness profiles also have uniform cross-sectional area between the fins.  
   
   
       5 . The apparatus of  claim 4 , wherein the all of the fins are configured to be suitable for manufacturing by an extrusion process.  
   
   
       6 . The apparatus of  claim 5 , wherein the thermally conductive core and the fins are aluminum.  
   
   
       7 . The apparatus of  claim 1 , wherein the thermally conductive core includes a copper portion.  
   
   
       8 . The apparatus of  claim 1 , further comprising: 
 two fins on opposite sides of the thermally conductive core which are longer than the other fins and are adapted to be utilized as structural members to transfer a preload to a heat source.    
   
   
       9 . The apparatus of  claim 8 , wherein the two longer fins are also thicker than the other fins.  
   
   
       10 . A method, comprising: 
 forming a thermally conductive core; and    forming at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length,    and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular form factor.    
   
   
       11 . The method of  claim 10 , wherein the fins having uniform length also have uniform thickness profiles.  
   
   
       12 . The method of  claim 11 , wherein the fins having uniform length and thickness profiles also have uniform tip-to-tip spacing.  
   
   
       13 . The method of  claim 11 , wherein the fins having uniform length and thickness profiles also have uniform cross-sectional area between the fins.  
   
   
       14 . The method of  claim 13 , further comprising: 
 forming all of the fins to be suitable for manufacturing by an extrusion process.    
   
   
       15 . The method of  claim 14 , further comprising: 
 extruding the thermally conductive core and fins from aluminum.    
   
   
       16 . The method of  claim 10 , further comprising: 
 forming the thermally conductive core to include a copper portion.    
   
   
       17 . The method of  claim 10 , further comprising: 
 forming two fins on opposite sides of the thermally conductive core which are longer than the other fins and are adapted to be utilized as structural members to transfer a preload to a heat source.    
   
   
       18 . The method of  claim 17 , wherein the two longer fins are also thicker than the other fins.  
   
   
       19 . A system, comprising: 
 a system board;    an electronic component on the system board; and    a heatsink thermally coupled to the electronic component, the heatsink comprising: 
 a thermally conductive core; and  
 at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length,  
 and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular form factor.  
   
   
   
       20 . The system of  claim 19 , wherein the fins having uniform length also have uniform thickness profiles.  
   
   
       21 . The system of  claim 20 , wherein the fins having uniform length and thickness profiles also have uniform tip-to-tip spacing.  
   
   
       22 . The system of  claim 20 , wherein the fins having uniform length and thickness profiles also have uniform cross-sectional area between the fins.  
   
   
       23 . The system of  claim 22 , wherein all of the fins are configured to be suitable for manufacturing by an extrusion process.  
   
   
       24 . The system of  claim 23 , wherein the thermally conductive core and the fins are aluminum.  
   
   
       25 . The system of  claim 19 , wherein the thermally conductive core includes a copper portion.  
   
   
       26 . The system of  claim 19 , further comprising: 
 two fins on opposite sides of the thermally conductive core which are longer than the other fins and are adapted to be utilized as structural members to transfer a preload to the electronic component.    
   
   
       27 . The system of  claim 26 , wherein the two longer fins are also thicker than the other fins.  
   
   
       28 . The system of  claim 19 , wherein the electronic component comprises a processor.  
   
   
       29 . The system of  claim 28 , further comprising: 
 a double data rate memory coupled to the system board.    
   
   
       30 . The system of  claim 19 , further comprising: 
 a rectangular form factor duct positioned around the heatsink; and    a fan positioned to provide cooling air through the duct.