Copper alloy powder for electrically conductive paste

Abstract

A copper alloy powder for an electrically conductive paste is provided, which is characterized in that the copper alloy powder comprises 80 to 99.9 mass % of Cu and 0.1 to 20 mass % of one or two elements selected from the group consisting of Ta and W and has an average particle size of 0.1 to 1 μm. This copper alloy powder has a higher starting temperature for sintering, higher oxidation resistance and better heat resistance than a copper powder.

1 . A copper alloy powder for an electrically conductive paste, comprising: 
 Cu in an amount of from 80 to 99.9 mass %; and    at least one element selected from the group consisting of Ta and W in an amount of from 0.1 to 20 mass %;    wherein the powder has an average particle size of from 0.1 to 1 μm.    
   
   
       2 . The copper alloy powder for an electrically conductive paste according to  claim 1 , wherein: 
 Cu is present in an amount of 99.5 mass % or less; and    the at least one element selected from the group consisting of Ta and W is present in an amount of at least 0.5 mass %.    
   
   
       3 . The copper alloy powder for an electrically conductive paste according to  claim 1 , wherein particles of the powder have a spherical shape.  
   
   
       4 . The copper alloy powder for an electrically conductive paste according to  claim 2 , wherein particles of the powder have a spherical shape.  
   
   
       5 . A conductive paste, comprising a copper alloy powder including: 
 Cu in an amount of from 80 to 99.9 mass %; and    at least one element selected from the group consisting of Ta and W in an amount of from 0.1 to 20 mass %;    wherein the powder has an average particle size of from 0.1 to 1 μm.    
   
   
       6 . The conductive paste according to  claim 5 , wherein, in the copper alloy powder: 
 Cu is present in an amount of 99.5 mass % or less; and    the at least one element selected from the group consisting of Ta and W is present in an amount of at least 0.5 mass %.    
   
   
       7 . The conductive paste according to  claim 5 , wherein particles of the copper alloy powder have a spherical shape.  
   
   
       8 . The conductive paste according to  claim 6 , wherein particles of the copper alloy powder have a spherical shape.