Apparatus and method for separating a semiconductor chip

Abstract

Example embodiments may provide an apparatus for and method of separating a semiconductor chip. In the example embodiments, a separating plate having an end insertable between a base tape and an adhesive film may move back and forth in a direction perpendicular to an edge of the semiconductor chip so as to separate the semiconductor chip. Example embodiments may allow fragile, thin semiconductor chips to be safely packaged without damage and thus may increase semiconductor chip yield.

1 . A separating apparatus, comprising:
 a separating plate configured to be movable, the separation plate having an end insertable between a semiconductor chip and a base;   a support on a bottom surface of the base; and   a transferring unit configured to transfer the semiconductor chip.   
   
   
       2 . The apparatus of  claim 1 , wherein the separating plate is configured to move back and forth in a direction perpendicular to an edge of the semiconductor chip. 
   
   
       3 . The apparatus of  claim 1 , wherein the separating plate end is insertable between an adhesive and the base, the adhesive configured to adhere the base and semiconductor chip. 
   
   
       4 . The apparatus of  claim 1 , wherein the base is a base tape. 
   
   
       5 . The apparatus of  claim 1 , wherein the end of the separating plate has a front end surface and a bottom end surface that make an angle with each other. 
   
   
       6 . The apparatus of  claim 5 , wherein the angle is about 15° to about 75°. 
   
   
       7 . The apparatus of  claim 1 , wherein the end of the separating plate has a rectangular shape. 
   
   
       8 . The apparatus of  claim 1 , wherein the end of the separating plate has a semi-circular shape. 
   
   
       9 . The apparatus of  claim 1 , wherein the end of the separating plate has a polygonal shape with a protruding center portion. 
   
   
       10 . The apparatus of  claim 1 , wherein the end of the separating plate has a fork-like shape formed by a plurality of protruded parallel pins. 
   
   
       11 . The apparatus of  claim 1 , wherein the separating plate has a thickness of about 10 μm to about 100 μm. 
   
   
       12 . The apparatus of  claim 1 , wherein the support has a protruding edge section. 
   
   
       13 . The apparatus of  claim 1 , further comprising:
 a pressing unit configured to push the separating plate against the base.   
   
   
       14 . The apparatus of  claim 1 , further comprising:
 a lifting unit configured to lift the separating plate and the semiconductor chip when the separating plate is inserted between the base and the semiconductor chip.   
   
   
       15 . The apparatus of  claim 1 , further comprising:
 a fixing unit configured to hold the semiconductor chip when the separating plate is inserted between the base and the semiconductor chip.   
   
   
       16 . A method of separating a semiconductor chip from a base, the method comprising:
 aligning the semiconductor chip;   inserting a separating plate between the base under the semiconductor chip and the semiconductor chip; and   moving the semiconductor chip from the separating plate using a transferring unit.   
   
   
       17 . The method of  claim 16 , wherein inserting the separating plate between the base and the semiconductor chip includes inserting the separating plate between the base and an adhesive, the adhesive being between the base and the semiconductor chip. 
   
   
       18 . The method of  claim 16 , further comprising:
 placing the separation plate in an original position in which the separation plate was placed before the aligning of the semiconductor chip.   
   
   
       19 . The method of  claim 16 , wherein the inserting of the separating plate is performed at a temperature range of about 10° C. to about 40° C. 
   
   
       20 . The method of  claim 16 , wherein the aligning of the semiconductor chip includes aligning an edge of the semiconductor chip in a direction perpendicular to a moving direction of the separating plate. 
   
   
       21 . The method of  claim 16 , wherein the separating plate is pushed against the base when the separating plate is inserted between the base and the semiconductor chip. 
   
   
       22 . The method of  claim 16 , further comprising:
 holding the base to a support by creating a vacuum between the base and the support prior to the inserting of the separating plate.   
   
   
       23 . The method of  claim 22 , wherein the vacuum is released when the separating plate is first inserted between the base and the semiconductor chip. 
   
   
       24 . The method of  claim 16 , further comprising:
 fixing the semiconductor chip using a fixing unit prior to the inserting of the separating plate.   
   
   
       25 . The method of  claim 24 , wherein the fixing unit contacts the semiconductor chip and creates a vacuum to fix the semiconductor chip. 
   
   
       26 . The method of  claim 16 , further comprising:
 lifting the separating plate to lift the semiconductor chip after the inserting of the separating plate.   
   
   
       27 . The method of  claim 16 , wherein the moving of the semiconductor chip includes placing the transferring unit on the semiconductor chip and creating a vacuum between the transferring unit and the semiconductor chip and releasing the vacuum after the semiconductor chip is moved to a desired position to separate the semiconductor from the transferring unit.