Solid-state imaging device, fabrication method of the same, and camera module

Abstract

There is provided a solid-state imaging device including: a semiconductor package support mounting a solid-state image sensor; bonding wires electrically connecting first terminals formed on the solid-state image sensor and second terminals formed on the semiconductor package support; a sealing member sealing at least the second terminals to which the bonding wires are connected; and an optically-transparent member made of an optically-transparent material and disposed above the solid-state image sensor, in which the optically-transparent member is supported by different support members formed on the semiconductor package support at three or more positions not on a single straight line.

1 . A solid-state imaging device comprising: 
 a semiconductor package support mounting a solid-state image sensor;    bonding wires electrically connecting first terminals formed on the solid-state image sensor and second terminals formed on the semiconductor package support;    a sealing member sealing at least the second terminals to which the bonding wires are connected; and    an optically-transparent member made of an optically transparent material and disposed above the solid-state image sensor,    wherein the optically-transparent member is supported by different support members formed on the semiconductor package support at three or more positions not on a single straight line.    
   
   
       2 . The solid-state imaging device according to  claim 1 , wherein: 
 the support members are formed on the semiconductor package support at at least three of four corners thereof.    
   
   
       3 . The solid-state imaging device according to  claim 1 , wherein: 
 the optically-transparent member is mounted on an upper surface of the sealing member.    
   
   
       4 . The solid-state imaging device according to  claim 1 , wherein: 
 the sealing member seals the bonding wires and the first terminals to which the bonding wires are connected.    
   
   
       5 . A fabrication method for a solid-state imaging device including: a semiconductor package support mounting a solid-state image sensor; bonding wires electrically connecting first terminals formed on the solid-state image sensor and second terminals formed on the semiconductor package support; a sealing member for sealing at least the second terminals to which the bonding wires are connected; and an optically-transparent member made of an optically-transparent material and disposed above the solid-state image sensor, wherein the optically-transparent member is supported by different support members formed on the semiconductor package support at three or more positions not on a single straight line, the fabrication method comprising the steps of: 
 mounting the solid-state image sensor on the semiconductor package support and electrically connecting the first terminals and the second terminals by the bonding wires;    sealing the second terminals to which the bonding wires are connected with a sealing member and thereafter disposing the optically-transparent member on the support members and the sealing member; and    curing the sealing member to fix the optically-transparent member.    
   
   
       6 . A fabrication method for a solid-state imaging device including: a semiconductor package support mounting a solid-state image sensor; bonding wires electrically connecting first terminals formed on the solid-state image sensor and second terminals formed on the semiconductor package support; a sealing member for sealing at least the second terminals to which the bonding wires are connected; and an optically-transparent member made of an optically-transparent material and disposed above the solid-state image sensor, wherein the optically-transparent member is supported by different support members formed on the semiconductor package support at three or more positions not on a single straight line, the fabrication method comprising steps of: 
 mounting the solid-state image sensor on the semiconductor package support and electrically connecting the first terminals and the second terminals by the bonding wires;    disposing the optically-transparent member on the support members by using a sealing material to fix the optically-transparent member and thereafter sealing the second terminals to which the bonding wires are connected with the sealing member; and    curing the sealing member.    
   
   
       7 . A camera module comprising: 
 a solid-state imaging device including a semiconductor package support mounting a solid-state image sensor; bonding wires electrically connecting first terminals formed on the solid-state image sensor and second terminals formed on the semiconductor package support; a sealing member for sealing at least the second terminals to which the bonding wires are connected; and an optically-transparent member made of an optically-transparent material and disposed above the solid-state image sensor;    a lens disposed above the solid-state imaging device; and    a lens barrel for supporting the lens,    wherein the optically-transparent member is supported by different support members formed on the semiconductor package support at three or more positions not on a single straight line.