US2007197042A1PendingUtilityA1
Method of varying etch selectivities of a film
Est. expiryDec 30, 2023(expired)· nominal 20-yr term from priority
Inventors:Justin K. Brask
H10P 50/667H10P 50/646H10P 50/283H10D 64/01346H10D 64/01342H10D 64/01316H10P 50/644H10P 10/00H10P 50/00H10D 30/62H10D 64/693H10D 84/0177H10D 84/038H10D 64/691H10D 64/665H10D 64/017H10D 30/601H10D 30/0227Y10S438/924
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Claims
Abstract
A method of patterning a crystalline film. A crystalline film having a degenerate lattice comprising first atoms in a first region and a second region is provided. Dopants are substituted for said first atoms in said first region to form a non-degenerate crystalline film in said first region. The first region and the second region are exposed to a wet etchant wherein the wet etchant etches the degenerate lattice in said second region without etching the non-degenerate lattice in the first region.
Claims
exact text as granted — not AI-modified1 . A method of patterning a crystalline film comprising:
forming a crystalline film having a degenerate lattice comprising first atoms in a first region and a second region; placing dopants into interstitial cites in said crystalline film in said first region wherein said dopants are electrically neutral with respect to said crystalline film; activating said dopants so that said dopants substitute with said first atoms in said lattice to form a non-degenerate lattice in said first region, said second region remaining a degenerate lattice; and exposing said first region and said second region to a wet etchant wherein said wet etchant etches said degenerate lattice in said second region without etching said non-degenerate lattice in said first region.
2 . The method of claim 1 wherein said crystalline film is a semiconductor film.
3 . The method of claim 2 wherein said semiconductor film is a silicon film.
4 . The method of claim 3 wherein said silicon film is a polycrystalline film.
5 . The method of claim 1 wherein said crystalline film is selected from the group consisting of gallium arsenide and InSb.
6 . The method of claim 1 wherein said etchant utilizing an associative reaction to etch said degenerate lattice.
7 . The method of claim 3 wherein said etchant is a non-oxidizing basic solution.
8 . The method of claim 7 wherein said etchant comprises a hydroxide with a pH between 9 and 11.
9 . The method of claim 5 wherein said etchant comprises an oxidant in the presence of an acid.
10 . The method of claim 9 wherein said etchant comprises an oxidant selected from the group consisting of nitric acid and hydrogen peroxide and wherein said etchant has a pH between 2 and 4.
11 . The method of claim 1 wherein said non-degenerate lattice in said first region has a first lattice energy and said degenerate lattice in said second region has a second lattice energy wherein said second lattice energy is thermodynamically higher (relatively less stable) than said first lattice energy.
12 . The method of claim 1 wherein said non-degenerate lattice has a first activation energy barrier to said etchant and said degenerate lattice has a second activation energy barrier to said etchant wherein said second activation energy barrier is less than said first activation barrier.
13 . The method of claim 12 wherein said etchant has a chemical energy greater than said second activation energy barrier and less than said first activation energy barrier.
14 . A method of patterning a crystalline film comprising:
forming a mask having an opening on a crystalline film having a lattice comprising first atoms, said opening formed over a first region and said mask covering a second region; implanting dopants atoms through said opening and into said first region of said crystalline film beneath said opening wherein said dopant atoms are physically larger than said first atoms; removing said mask; heating said crystalline film so that said dopants substitute with said first atoms in said lattice in said crystalline film in said first region; and exposing said first region and said second region to an etchant wherein said etchant etches said second region without etching said first region.
15 . The method of claim 14 wherein the lattice comprising dopants in said first region is a non-degenerate lattice.
16 . The method of claim 15 wherein said lattice in said second region is a degenerate lattice.
17 . A method of patterning a crystalline film comprising:
providing a crystalline film having a degenerate lattice comprising first atoms in a first region and a second region; substituting dopant atoms with said first atoms in said degenerate lattice in said first region to form a non-degenerate lattice in said first region wherein said dopants are electrically neutral with respect to said crystalline film; and exposing said first region having said non-degenerate lattice and said second region having said degenerate lattice to an etchant wherein said etchant etches said second region and not said first region.
18 . The method of claim 17 wherein said crystalline film is silicon.
19 . The method of claim 17 wherein said dopant atoms are boron.Cited by (0)
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