Multi-chamber spray cooling system

Abstract

The present invention uses multiple global cooling chambers for providing liquid cooling to a plurality of electronic components. The global cooling chambers utilize a non-electrically conductive fluid which is in direct contact with the components to be cooled. The system provides very effective heat transfer rates, environmental isolation of the electronics components and can be deployed in a wide range of applications. Multiple global cooling chambers allows for the hot swapping of cards during operation of the system.

1 . A closed loop liquid cooling system comprising: 
 a chassis having a plurality of sealed cooling chambers for housing one or more electronic cards;    a plurality of spray modules located within said plurality of cooling chambers for receiving a supply of dielectric liquid coolant and providing two-phase cooling to said one or more electronic cards;    a backplane electrically connecting said one or more electronic cards; and,    a plurality of removable faceplates attached to said chassis, for sealing said electronic cards within said plurality of cooling chambers.    
   
   
       2 . The closed loop liquid cooling system of  claim 1 , wherein said plurality of removable faceplates are made from a clear material.  
   
   
       3 . The closed loop liquid cooling system of  claim 1 , wherein said one or more electronic cards include a blade server.  
   
   
       4 . The closed loop liquid cooling system of  claim 1 , wherein said dielectric fluid is a perfluorocarbon.  
   
   
       5 . A closed loop liquid cooling system comprising: 
 a chassis having a plurality of sealed cooling chambers for housing one or more electronic cards;    a plurality of spray modules located within said plurality of cooling chambers for receiving a supply of dielectric liquid coolant and providing two-phase cooling to said one or more electronic cards;    a plurality of sealing connectors attached to said plurality of cooling chambers and electrically connected to said one or more electronic cards,    a backplane electrically connecting said plurality of sealing connectors; and,    a plurality of removable faceplates attached to said chassis, for sealing said electronic cards within said plurality of cooling chambers.    
   
   
       6 . The closed loop liquid cooling system of  claim 5 , wherein said plurality of removable faceplates are made from a clear material.  
   
   
       7 . The closed loop liquid cooling system of  claim 5 , wherein said one or more electronic cards include a blade server.  
   
   
       8 . The closed loop liquid cooling system of  claim 5 , wherein said dielectric fluid is a perfluorocarbon.  
   
   
       9 . A liquid cooling chassis for providing global cooling to a plurality of electronic cards, said chassis comprising: 
 a plurality of cooling chambers having a generally cubic structure, said plurality of cooling chambers having a plurality of access openings in the front of said chambers and a plurality of electrical connectors sealed to the back of said chambers;    a plurality of electrical cards connected to said plurality of electrical connectors of said chassis;    a plurality of covers removably sealable to said plurality of access openings;    a plurality of cooling modules adjacent to said plurality of electronic cards; and,    wherein a liquid cooling system is fluidly connected to said cooling modules for providing two-phase dielectric cooling to said plurality of electronic cards.    
   
   
       10 . The closed loop liquid cooling system of  claim 9 , wherein said plurality of removable faceplates are made from a clear material.  
   
   
       11 . The closed loop liquid cooling system of  claim 9 , wherein said one or more electronic cards include a blade server.  
   
   
       12 . The closed loop liquid cooling system of  claim 9 , wherein said dielectric fluid is a perfluorocarbon.