Electromagnetic Interference Shields for Electronic Devices

Abstract

An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.

1 . An EMI/RFI shielding device comprising: 
 a shaped polymer substrate comprised of metallized polymer substrate, wherein the shaped polymer substrate is substantially conductive; and    a conductive material on at least one surface of the shaped polymer substrate.    
   
   
       2 . The EMI/RFI shielding device of  claim 1  wherein the recycled metallized polymer substrate comprises a reground and re-extruded metallized thermoform.  
   
   
       3 . The EMI/RFI shielding device of  claim 1  wherein the conductive material has a thickness between 1.0 micron and 50.0 microns.  
   
   
       4 . The EMI/RFI shielding device of  claim 1  wherein the conductive material comprises aluminum.  
   
   
       5 . The EMI/RFI shielding device of  claim 1  wherein the conductive material comprises a substantially uniform thickness over at least one surface of the shaped polymer substrate.  
   
   
       6 . The EMI/RFI shielding device of  claim 1  wherein the shaped polymer substrate has a thickness between 0.006 inches to 0.100 inches.  
   
   
       7 . An EMI/RFI shield comprising: 
 a thermoformed thin-walled shape formed of a recycled metallized polymeric material, wherein the thermoformed thin-walled shape comprises an inner surface, an outer surface and edges; and    a conductive material deposited on at least one of the inner surface and outer surface, wherein the conductive coating comprises a substantially even thickness between 1 micron to 50 microns.    
   
   
       8 . The EMI/RFI shield of  claim 7  wherein the conductive material comprises vacuum deposited aluminum.  
   
   
       9 . The EMI/RFI shield of  claim 7  wherein the recycled metallized polymeric material comprises a reground and re-extruded metal layer and a polymeric material.  
   
   
       10 . The EMI/RFI shield of  claim 7  wherein the thermoformed thin-walled shape has a thickness between 0.006 inches to 0.100 inches.  
   
   
       11 . The EMI/RFI shielding device of  claim 1  further comprising grinding and re-extruding a metal material along with the polymer substrate.  
   
   
       12 . The EMI/RFI shielding device of  claim 1  wherein the conductive material comprises copper.  
   
   
       13 . The EMI/RFI shielding device of  claim 1  wherein the conductive material comprises nickel.  
   
   
       14 . The EMI/RFI shield of  claim 7  wherein the conductive material comprises vacuum deposited copper.  
   
   
       15 . The EMI/RFI shield of  claim 7  wherein the conductive material comprises vacuum deposited nickel.