Circuit and method for error test, recordation, and repair

Abstract

A contactor card assembly for use with a semiconductor substrate. An upper keeper plate and a lower keeper plate each include a number of conductive pins extending therethrough, situated in vias filled with an elastomeric material and extending beyond the keeper plates to contact a substrate for testing. An intermediate keeper plate is situated between the upper and lower keeper plates and includes conductive pivot bars in channels filled with elastomeric material. Each conductive pin contacts a pivot bar on one side thereof to electrically communicate with a corresponding pin on the opposite side. Under compression, variations in the height of contacts on the substrate under test are adjusted for by the movement of the pins and pivoting of the pivot bar in the elastomeric material. Methods and process for creating the keeper plates and semiconductor and testing assemblies are also included in the present invention.

1 - 11 . (canceled)  
   
   
       12 . A keeper plate for an assembly for contacting an array of contacts on a 
 semiconductor substrate comprising:    a substantially planar substrate having a first surface and an opposite second surface;    at least a first via extending through the substantially planar substrate;    a first elastomeric material disposed in the at least a first via, and having a first surface substantially coplanar with the first surface of the substantially planar substrate and an opposite, second surface substantially coplanar with the opposite second surface of the substantially planar substrate; and    a first electrically conductive contact pin disposed in the at least a first via, the first contact pin flexibly retained in the at least a first via by the first elastomeric material and extending beyond the first surface and the opposite second surface of the substantially planar substrate.    
   
   
       13 . The keeper plate of  claim 12 , further comprising: 
 at least a second via extending through the substantially planar substrate;    a second elastomeric material disposed in the at least a second via; and    a second electrically conductive contact pin disposed in the at least a second via, the second contact pin flexibly retained in the at least a second via by the second elastomeric material and extending beyond the first surface and the opposite second surface of the substantially planar substrate.    
   
   
       14 . The keeper plate of  claim 12 , wherein the substantially planar substrate is electrically conductive and the first elastomeric material comprises a non-conductive material.  
   
   
       15 . The keeper plate of  claim 12 , wherein the substantially planar substrate is electrically non-conductive and the first elastomeric material comprises an electrically conductive material.  
   
   
       16 . The keeper plate of  claim 12 , wherein the first elastomeric material comprises silicone.  
   
   
       17 . The keeper plate of  claim 12 , wherein the substantially planar substrate comprises a semiconductor wafer.  
   
   
       18 . The keeper plate of  claim 12 , wherein the first contact pin is removable from the first elastomeric material to allow replacement thereof.  
   
   
       19 . The keeper plate of  claim 12 , wherein the first contact pin comprises a gold plated copper wire, or a gold wire plated with nickel and having an outer coating of gold or other conductive metal.  
   
   
       20 . The keeper plate of  claim 12 , further comprising an alignment via therethrough configured for alignment of the keeper plate to an assembly for contacting an array of contacts on a semiconductor substrate.  
   
   
       21 . A method for forming an assembly for contacting an array of semiconductor contacts of a semiconductor device, comprising: 
 providing a substrate having a first surface and an opposite second surface;    forming at least a first via in the substrate that extends from the first surface to the opposite second surface;    dispensing an elastomeric material in the at least a first via to have a first surface substantially coplanar with the first surface of the substrate and an opposite, second surface substantially coplanar with the opposite second surface of the substrate; and    placing a first electrically conductive contact pin in the at least a first via for the first contact pin to extend beyond the first surface and the opposite second surface of the substrate.    
   
   
       22 . The method according to  claim 21 , wherein placing a first contact pin in the at least a first via comprises placing a first contact pin in the at least a first via prior to dispensing the elastomeric material therein.  
   
   
       23 . The method according to  claim 21 , wherein placing a first contact pin in the at least a first via comprises forming a hole through the elastomeric material dispensed in the at least a first via for placing the first contact pin therein.  
   
   
       24 . The method according to  claim 23 , wherein forming a hole through an elastomeric material dispensed in the at least a first via comprises laser ablating a hole through the elastomeric material.  
   
   
       25 . The method according to  claim 21 , wherein the substrate is electrically conductive and dispensing the elastomeric material in the at least a first via comprises dispensing an electrically non-conductive elastomeric material.  
   
   
       26 . The method according to  claim 25 ,wherein dispensing an elastomeric material in the at least a first via comprises dispensing silicone.  
   
   
       27 . The method according to  claim 21 , wherein the substrate is non-electrically conductive and dispensing an elastomeric material in the at least a first via comprises dispensing an electrically conductive elastomeric material.  
   
   
       28 . The method according to  claim 21 , wherein providing a substrate having a first surface and an opposite second surface comprises providing a semiconductor wafer.  
   
   
       29 . The method according to  claim 21 , wherein forming at least a first via in the substrate that extends from the first surface to the second surface comprises etching a via through the substrate.  
   
   
       30 . The method according to  claim 21 , wherein forming at least a first via in the substrate that extends from the first surface to the second surface comprises boring a via through the substrate by laser ablation, mechanical drilling or a combination thereof  
   
   
       31 . The method according to  claim 21 , wherein placing a first contact pin in the at least a first via comprises placing a wire in the at least a first via.  
   
   
       32 . The method according to  claim 31 , wherein placing a wire in the at least a first via comprises placing a gold plated copper wire or a gold wire plated with nickel and having an outer coating of gold or other conductive material in the at least a first via.  
   
   
       33 . The method according to  claim 21 , wherein placing a first contact pin in the at least a first via comprises using a jig to position the first contact pin in the at least a first via.