US2007205409A1PendingUtilityA1

Process for making contained layers and devices made with same

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Assignee: LECLOUX DANIEL DAVIDPriority: Mar 2, 2006Filed: Jun 1, 2006Published: Sep 6, 2007
Est. expiryMar 2, 2026(expired)· nominal 20-yr term from priority
H10K 71/40H10K 71/135H10K 71/13H10K 50/11H10K 71/233H10K 71/12H10K 71/166H10K 71/00
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Claims

Abstract

There is provided a process for forming a contained second layer over a first layer, including the steps: forming the first layer having a first surface energy; treating the first layer with a reactive surface-active composition to form a treated first layer having a second surface energy which is lower than the first surface energy; exposing the treated first layer with radiation; and forming the second layer. There is also provided an organic electronic device made by the process.

Claims

exact text as granted — not AI-modified
1 . A process for forming a contained second layer over a first layer, said process comprising:
 forming the first layer having a first surface energy;   treating the first layer with a reactive surface-active composition to form a treated first layer having a second surface energy which is lower than the first surface energy;   exposing the treated first layer with radiation; and   forming the second layer.   
   
   
       2 . The process of  claim 1 , wherein the reactive surface-active composition is a fluorinated material. 
   
   
       3 . The process of  claim 1 , wherein the reactive surface-active composition is a radiation-hardenable material. 
   
   
       4 . The process of  claim 1 , wherein the reactive surface-active composition is a crosslinkable fluorinated surfactant. 
   
   
       5 . The process of  claim 1 , wherein the reactive surface-active composition is deposited with the first layer. 
   
   
       6 . The process of  claim 1 , wherein the reactive surface-active composition is applied as a separate layer over the first layer. 
   
   
       7 . The process of  claim 1 , wherein the radiation is applied in a pattern to form exposed regions and unexposed region of the reactive surface-active composition. 
   
   
       8 . The process of  claim 7 , further comprising removing either the exposed or unexposed regions of the reactive surface-active composition. 
   
   
       9 . The process of  claim 8 , wherein the regions are removed by treating with a liquid. 
   
   
       10 . The process of  claim 8 , wherein the regions are removed by heating. 
   
   
       11 . The process of  claim 8 , wherein the regions are removed by contacting an outermost surface of the with an absorbent surface to absorb or wick away the softer regions. 
   
   
       12 . A process for making an organic electronic device comprising a first organic active layer and a second organic active layer positioned over an electrode, said process comprising
 forming the first organic active layer having a first surface energy over the electrode   treating the first organic active layer with a reactive surface-active composition to form a treated first organic active layer,   exposing the treated first organic active layer with radiation, thereby reducing the first surface energy, and   forming the second organic active layer.   
   
   
       13 . An organic electronic device comprising a first organic active layer and a second organic active layer positioned over an electrode, and further comprising a reactive surface-active composition between the first organic active layer and the second organic active layer.

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