US2007224857A1PendingUtilityA1

Cap for an electrical connector

Assignee: HARPER DONALD K JRPriority: Dec 21, 2004Filed: Jun 4, 2007Published: Sep 27, 2007
Est. expiryDec 21, 2024(expired)· nominal 20-yr term from priority
H05K 2201/10189H05K 3/3436H01R 12/707H05K 2203/159H05K 2201/10446H01R 13/514H01R 12/724H01R 13/502H01R 43/0263H05K 3/3405
54
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

An electrical assembly that may include a weighted cap. The weighted cap may provide counterbalancing to a non-proportional ball-grid array connector integrated circuit package for connection with a substrate. The weighted cap provides compensation for variations in the imbalance of the electronic connector package against the substrate.

Claims

exact text as granted — not AI-modified
1 . A method for mounting an electrical connector to a substrate comprising: 
 placing the electrical connector onto the substrate so that a fusible element substantially aligns with a contact pad on the substrate;    providing a cap for the electrical connector, wherein the cap has a geometric center offset from a center of gravity of the electrical connector;    placing the cap onto the electrical connector to counterbalance the electrical connector; and    heating the electrical connector and the substrate to create at least one electrical connection there between.    
   
   
       2 . The method of  claim 1 , wherein the connector is a ball-grid array connector.  
   
   
       3 . The method of  claim 1 , further comprising placing the cap onto the electrical connector with a vacuum head.  
   
   
       4 . The method of  claim 3 , wherein the vacuum head mates with the cap.  
   
   
       5 . The method of  claim 1 , further comprising releasing the cap from the vacuum head onto the electrical connector before heating.  
   
   
       6 . The method of  claim 1 , wherein placing the cap onto the electrical connector causes the electrical connector to balance in equilibrium across the fusible element.  
   
   
       7 . The method of  claim 1 , further comprising removing the cap from the electrical connector with the vacuum head after heating.  
   
   
       8 . The method of  claim 1 , wherein said heating is performed by a solder reflow process.  
   
   
       9 . The method of  claim 1 , wherein placing the cap onto the electrical connector promotes the fusible element on the electrical connector to align with the contact pad on the substrate.  
   
   
       10 . An assembly, comprising: 
 a substrate, said substrate comprising an upper side having at least one contact pad for connection;    an electrical connector, said electrical connector comprising a housing, an electrical conductor mounted within the housing, a fusible element attached to the electrical conductor for forming an electrical connection with the substrate, a center of gravity, and a geometric center, wherein the center of gravity of said electrical connector is offset from the geometric center of said electrical connector along at least one axis; and    a cap for mating with the electrical connector, said cap comprising a body with a center of gravity and a geometric center, wherein the center of gravity of said cap is offset from the geometric center of said cap so that said cap balances said electrical connector on said substrate when said cap is placed thereon.    
   
   
       11 . The electronic assembly of  claim 10 , wherein said electrical connector is a ball-grid array connector.  
   
   
       12 . The electronic assembly of  claim 10 , wherein said cap is integral to said electrical connector.  
   
   
       13 . The electronic assembly of  claim 10 , wherein said cap is separable from said electrical connector.

Join the waitlist — get patent alerts

Track US2007224857A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.