Chemical Mechanical Polishing Pad

Abstract

A polishing pad has polishing elements of at least two different types of materials, each having a different coefficient of friction, and arranged over a surface of the pad so as to provide a non-planar material removal profile for the pad. The polishing elements may be arranged to provide different material removal profiles, such as an edge-fast, edge-slow, center-fast or center-slow material removal profile.

1 . A polishing pad, comprising polishing elements of at least two different types of materials, each having a different coefficient of friction, and arranged over a surface of the pad so as to provide a non-planar material removal profile for the pad. 
     
     
         2 . The polishing pad of  claim 1 , wherein the polishing elements are arranged to provide an edge-fast material removal profile. 
     
     
         3 . The polishing pad of  claim 1 , wherein the polishing elements are arranged to provide an edge-slow material removal profile. 
     
     
         4 . The polishing pad of  claim 1 , wherein the polishing elements are arranged to provide a center-fast material removal profile. 
     
     
         5 . The polishing pad of  claim 1 , wherein the polishing elements are arranged to provide a center-slow material removal profile. 
     
     
         6 . A polishing pad, comprising a plurality of polishing elements of at least two different materials, each having a different coefficient of friction, and arranged in different densities across a surface of the pad so as to provide a non-planar material removal profile for the pad. 
     
     
         7 . A polishing pad, comprising a plurality of polishing elements, some of which are polyurethane and others of which are Delrin, the polishing elements arranged in a radial manner across a surface of the pad such that those of the polishing elements which are Delrin comprise approximately 5-50% of the total number of polishing elements in locations corresponding to areas of the pad configured to provide relatively lower material removal rates than other areas of the pad. 
     
     
         8 . The polishing pad of  claim 7 , wherein an overall density of polishing elements is uniform per unit area of the pad. 
     
     
         9 . The polishing pad of  claim 7 , wherein the polishing elements are laid out in a uniform radial arrangement. 
     
     
         10 . The polishing pad of  claim 7 , wherein both the Delrin and polyurethane polishing elements have a common shape and size.