US2007227170A1PendingUtilityA1

Cooling system for computer

Assignee: PENG XUE-WENPriority: Mar 30, 2006Filed: Mar 30, 2006Published: Oct 4, 2007
Est. expiryMar 30, 2026(expired)· nominal 20-yr term from priority
Inventors:Xue-Wen Peng
G06F 1/20
39
PatentIndex Score
0
Cited by
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References
0
Claims

Abstract

A computer cooling system includes a computer housing, a refrigeration loop and two fans. The housing includes an inner layer and an outer layer and defines an air inlet and an air outlet on opposite sides thereof. The refrigeration loop orderly includes a compressor, a condenser, an expansion valve, an evaporator and pipes connecting the compressor, the condenser, the expansion valve and the evaporator. The compressor and the pipes are located between the inner and outer layers. The fans are respectively located near the air inlet and the air outlet, in order to draw air into the housing and expel the air out of the housing.

Claims

exact text as granted — not AI-modified
1 . A computer cooling system comprising: 
 a computer housing comprising an inner layer and an outer layer and defining an air inlet and an air outlet on opposite sides thereof;    a refrigeration loop orderly comprising a compressor, a condenser, an expansion valve, an evaporator and pipes connecting the compressor, the condenser, the expansion valve and the evaporator, the compressor and the pipes being located between the inner and outer layers; and    two fans respectively located near the air inlet and the air outlet, for drawing air into the housing and expelling the air out of the housing, respectively.    
   
   
       2 . The computer cooling system as claimed in  claim 1 , wherein the pipe connecting the compressor and the condenser is close to the inner layer of the housing.  
   
   
       3 . The computer cooling system as claimed in  claim 1 , wherein the pipe connecting the evaporator and the compressor is coated with a thermal insulation material.  
   
   
       4 . The computer cooling system as claimed in  claim 1 , wherein the compressor is located at a bottom of the room.  
   
   
       5 . The computer cooling system as claimed in  claim 1 , wherein the condenser is near the air outlet.  
   
   
       6 . The computer cooling system as claimed in  claim 1 , wherein the evaporator is approximate to the air inlet.  
   
   
       7 . The computer cooling system as claimed in  claim 1 , wherein the expansion valve is between the condenser and the evaporator and is close to the evaporator.  
   
   
       8 . The computer cooling system as claimed in  claim 1 , wherein the inner and outer layers are arranged on lateral sides of the housing.  
   
   
       9 . A cooling system for an electronic device, comprising: 
 a housing of the electronic device, comprising an inner layer and an outer layer and defining an air inlet and an air outlet on opposite sides thereof;    a first fan located near the air inlet, the fan drawing air into the housing;    a second fan located near the air outlet, the second fan expelling air out of the housing;    a refrigeration loop located between the inner and outer layers of the housing;    wherein the refrigeration loop contains refrigerant therein, and the refrigerant in the refrigeration loop approximate to the air outlet has a temperature higher than the air passing through the refrigeration loop and the refrigerant in the refrigeration loop approximate to the air inlet has a temperature lower than the air passing through the refrigeration loop.    
   
   
       10 . The cooling system as claimed in  claim 9 , wherein the refrigeration loop comprises an evaporator near the air inlet to cool the air entering the housing via the refrigerant therein.  
   
   
       11 . The cooling system as claimed in  claim 9 , wherein the refrigeration loop comprises a condenser close to the air outlet, the refrigerant in the condenser is cooled by the air passing through the refrigeration loop.  
   
   
       12 . A computer comprising: 
 a housing having an inner layer and an outer layer thereby defining a room between the inner and outer layers, and defining an air inlet and an air outlet, an airflow being generated to flow from the air inlet through the housing to the air outlet;    a heat generating component received in the housing, the airflow flowing through the heat generating component; and    a refrigeration system received in the room, having an evaporator located near the air inlet and a condenser located near the air outlet, the evaporator absorbing heat from the airflow, the condenser releasing heat to the airflow, the refrigeration system including refrigerant therein.    
   
   
       13 . The computer as claimed in  claim 12 , wherein the refrigeration system further comprises a compressor between the condenser and the evaporator, a pipe interconnecting the compressor and the evaporator, the pipe being surrounded with a thermal insulation material, the refrigerant flowing from the condenser through the compressor to the evaporator.  
   
   
       14 . The computer as claimed in  claim 13 , wherein the refrigeration system further comprises an expansion valve between the condenser and the evaporator, the refrigerant flows from the condenser to the evaporator through the expansion valve.  
   
   
       15 . The computer as claimed in  claim 13 , wherein the refrigeration system further comprises a second pipe interconnecting the condenser and the compressor, the second pipe being located close to the inner layer of the housing.  
   
   
       16 . The computer as claimed in  claim 12 , wherein the air inlet is provided in a front wall of the housing, and the air outlet is provided in a rear wall of the housing.  
   
   
       17 . The computer as claimed in  claim 16 , wherein two fans are provided in the housing near the air inlet and the air outlet, respectively.

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